Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.

Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.

Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.

Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.

Abstract: An energy blending device has a first input for alternating current, a second input for connection to a solar array, and an output, the energy blending device receiving energy from the first input, both inputs coupled to power an energy blending node. The device is in a configuration either with the solar array matching a voltage of the energy blending node, the blending node providing power through a DC-DC converter to a load interface device, and the solar array coupled through a DC-DC converter to the energy blending node, the energy blending node providing power to a load interface device. A microcontroller controls the DC-DC converter and a load interface device. The energy blending device has an energy storage system having a battery coupled either directly to the energy blending node or through a bidirectional energy storage interface to the energy blending node.

Abstract: An energy blending device has a first input for alternating current, a second input for connection to a solar array, and an output, the energy blending device receiving energy from the first input, both inputs coupled to power an energy blending node. The device is in a configuration either with the solar array matching a voltage of the energy blending node, the blending node providing power through a DC-DC converter to a load interface device, and the solar array coupled through a DC-DC converter to the energy blending node, the energy blending node providing power to a load interface device. A microcontroller controls the DC-DC converter and a load interface device. The energy blending device has an energy storage system having a battery coupled either directly to the energy blending node or through a bidirectional energy storage interface to the energy blending node.

Abstract: A bidirectional composite converter is provided. The bidirectional composite converter can be used with power electronics, such as but not limited to electric vehicles and other applications. In some implementations, for example, the composite converter may be used in a powertrain of an electric vehicle to couple batteries to a high voltage bus of the vehicle to provide power to the motors and to one or more integrated charging ports (e.g., ac grid wired connections or a wireless charging port) for extremely fast charging. In various implementations, the bidirectional converter architecture may comprise one or more dc transformer modules (DCX's) arranged with output port(s) coupled in series at an output port of the composite converter.

Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.

Abstract: An energy blending device has a first input for alternating current, a second input for connection to a solar array, and an output, the energy blending device receiving energy from the first input, both inputs coupled to power an energy blending node. The device is in a configuration either with the solar array matching a voltage of the energy blending node, the blending node providing power through a DC-DC converter to a load interface device, and the solar array coupled through a DC-DC converter to the energy blending node, the energy blending node providing power to a load interface device. A microcontroller controls the DC-DC converter and a load interface device. The energy blending device has an energy storage system having a battery coupled either directly to the energy blending node or through a bidirectional energy storage interface to the energy blending node.

Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.