Abstract: The present invention relates to the field of LIDAR technology, and in particular to an optical package structure for a LIDAR. An optical package structure for a LIDAR includes a housing; a laser transceiver component arranged in the housing, and configured to emit a laser and to receive for detection; a temperature control component arranged in the housing and connected to the laser transceiver component; and a conduction circuit board arranged on the housing and electrically connected to an external circuit board. The conduction circuit board is arranged to be electrically connected to the laser transceiver component.

Abstract: An optical transceiver sub-assembly (100) integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber (105) and a top cover (110) to enclose elements of the optical transceiver sub-assembly (100) other than the housing chamber (105) and the top cover (110), a bottom housing module (115) accommodating an optical micro integration (130). In particular, the optical transceiver sub-assembly (100) is operably configured to establish an optical-electrical communication with an outside surrounding.

Abstract: An optical transceiver sub-assembly (100) integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber (105) and a top cover (110) to enclose elements of the optical transceiver sub-assembly (100) other than the housing chamber (105) and the top cover (110), a bottom housing module (115) accommodating an optical micro integration (130). In particular, the optical transceiver sub-assembly (100) is operably configured to establish an optical-electrical communication with an outside surrounding.

Abstract: An optical interposer for providing optimal optical coupling between an optical transceiver interface and an external optical interface includes an interposer photonic integrated circuit (PIC) operably configured to couple an optical signal between the optical transceiver interface and the external optical interface, one or more waveguide based optical devices operably integrated on a common substrate and one or more of interposer input/output (I/O) channels operably configured with the optical transceiver interface and the external optical interface.

Abstract: A transmitter optical sub-assembly (TOSA) structure having an independent upward heat dissipation path for dissipating heat in an upward direction including an independent signal source, an LDU assembly including a laser diode emitting a plurality of optical signals, a cascade LDU holding the laser diode, a lens positioned in front of the laser diode on the cascade LDU and an optical bench assembly including an optical bench assembled on a photonic integrated circuit having a plurality of passive optical components assembled on the optical bench. In particular, the independent signal source, the laser diode and the cascade LDU, are independent from the plurality of passive optical components on the photonic integrated circuit.

Abstract: An optical mode converter for coupling between photonic integrated circuit (PIC) and optical fiber of different mode sizes is illustrated. The optical mode converter includes a waveguide assembly including a Single waveguide structure, a Multi-layer waveguide structure, and a Transitional waveguide structure. The Single waveguide structure includes a single waveguide. The dimension and propagation constant of a first end, of the single waveguide, is similar to a waveguide of a photonic integrated circuit (PIC). Furthermore, the Multi-layer waveguide structure included a multi-layer waveguide. Further, the Transitional waveguide structure is formed at a transitional structure. The Transitional waveguide structure allows transition of an optical mode between the Single waveguide structure and Multi-layer waveguide structure.

Abstract: A transmitter optical sub-assembly (TOSA) structure having an independent upward heat dissipation path for dissipating heat in an upward direction including an independent signal source, an LDU assembly including a laser diode emitting a plurality of optical signals, a cascade LDU holding the laser diode, a lens positioned in front of the laser diode on the cascade LDU and an optical bench assembly including an optical bench assembled on a photonic integrated circuit having a plurality of passive optical components assembled on the optical bench. In particular, the independent signal source, the laser diode and the cascade LDU, are independent from the plurality of passive optical components on the photonic integrated circuit.

Abstract: An optical interposer for providing optimal optical coupling between an optical transceiver interface and an external optical interface includes an interposer photonic integrated circuit (PIC) operably configured to couple an optical signal between the optical transceiver interface and the external optical interface, one or more waveguide based optical devices operably integrated on a common substrate and one or more of interposer input/output (I/O) channels operably configured with the optical transceiver interface and the external optical interface.

Abstract: A method and a system for active alignment of a light source assembly along three dimensions in an optical bench plane are provided. The light source assembly, preferably a laser diode on its sub-mount, is actively aligned in three dimensions, longitudinal, transection and vertical along the optical bench. The light source assembly is attached on edge of the optical bench, via adhesion processes, such as solder welding. Optical components such as collimator lens, isolator, etc are first passively aligned on the optical bench using alignment marks and epoxy slots provided on the surface of the optical bench. Then, laser diode, mounted on a laser diode sub-mount, is aligned in X and Z direction. Thereafter, the light source assembly is pushed towards the edge of the optical bench and attached with the edge via a solder joint. Also, a compensator can be actively aligned until the optimum light intensity achieved.

Abstract: A method and a system for active alignment of a light source assembly along three dimensions in an optical bench plane are provided. The light source assembly, preferably a laser diode on its sub-mount, is actively aligned in three dimensions, longitudinal, transection and vertical along the optical bench. The light source assembly is attached on edge of the optical bench, via adhesion processes, such as solder welding. Optical components such as collimator lens, isolator, etc are first passively aligned on the optical bench using alignment marks and epoxy slots provided on the surface of the optical bench. Then, laser diode, mounted on a laser diode sub-mount, is aligned in X and Z direction. Thereafter, the light source assembly is pushed towards the edge of the optical bench and attached with the edge via a solder joint. Also, a compensator can be actively aligned until the optimum light intensity achieved.

Abstract: The present disclosure relates to an enclosed electronic module with single/multiple active components and an integrated heat dissipation system, including a top housing formed with one or more openings, a heat sink mounted on an outer surface of the top housing over the opening(s) thereof, a bottom housing coupled with the top housing, one or more active components mounted on a PCB between the top and bottom housings, and at least one thermal block or vapor chamber thermally connected between the heat sink and the active component(s), thereby forming one or more thermal dissipation paths extending from the active component(s), through the at least one thermal block or vapor chamber, and to the heat sink.

Abstract: An optical mode converter for coupling between photonic integrated circuit (PIC) and optical fiber of different mode sizes is illustrated. The optical mode converter includes a waveguide assembly including a Single waveguide structure, a Multi-layer waveguide structure, and a Transitional waveguide structure. The Single waveguide structure includes a single waveguide. The dimension and propagation constant of a first end, of the single waveguide, is similar to a waveguide of a photonic integrated circuit (PIC). Furthermore, the Multi-layer waveguide structure included a multi-layer waveguide. Further, the Transitional waveguide structure is formed at a transitional structure. The Transitional waveguide structure allows transition of an optical mode between the Single waveguide structure and Multi-layer waveguide structure.

Abstract: The present disclosure relates to an enclosed electronic module with single/multiple active components and an integrated heat dissipation system, including a top housing formed with one or more openings, a heat sink mounted on an outer surface of the top housing over the opening(s) thereof, a bottom housing coupled with the top housing, one or more active components mounted on a PCB between the top and bottom housings, and at least one thermal block or vapor chamber thermally connected between the heat sink and the active component(s), thereby forming one or more thermal dissipation paths extending from the active component(s), through the at least one thermal block or vapor chamber, and to the heat sink.

Abstract: A silicon photonics package includes an L-shaped block formed from a cuboid having a through-hole through front and rear faces thereof. The L-shaped block includes two horizontal inner surfaces lying in a plane longitudinally bisecting a section of the through-hole, a bisected through-hole formed between the two horizontal inner surfaces, and a vertical inner surface. A lens block with a lens or lens array is bonded on the rear face of the L-shaped block. A vertical metal pad is attached on the front face of the L-shaped block. The vertical metal pad is soldered together with two horizontal metal pads on a photonic integrated circuit block formed with a waveguide or waveguide array such that the center of the optical lens is optically aligned with the waveguide. A method for fabricating the silicon photonics package, and an active alignment method for light coupling are also disclosed.

Abstract: A micro optical engine assembly including a printed circuit board, a frame mounted on the printed circuit board, a micro optical engine mounted on the printed circuit board within a central space of the frame, a jumper having a lens-carrying end placed on top of the micro optical engine and aligned therewith by alignment members to thereby limit horizontal movement of the jumper, and a latch having a snap mechanism releasably snapped onto the frame, and at least one spring plate resiliently pressing against an upper surface of the jumper when the latch is snapped onto the frame to thereby limit vertical movement of the jumper.

Abstract: A CWDM transceiver module includes: a substrate; a plurality of light sources disposed on the substrate; a spacer layer disposed above the substrate, a cavity being defined in the space layer to accommodate the light sources; a cap layer transparent to light emitted from the light sources and disposed on the spacer layer, a notch for assembling a waveguide being formed in the cap layer; a plurality of lenses disposed on the cap layer facing the light sources; reflector coating and filter coating disposed on surfaces of the cap layer; an active alignment element disposed on the cap layer; and a reflector disposed at bottom of the notch.