Abstract: A spatial light modulator includes a substrate; a hinge in connection with the substrate; a mirror plate that is connected with the hinge and is configured to tilt about the hinge; and a piezoelectric device coupled with the substrate. The piezoelectric device is configured to produce an acoustic wave to assist the separation between the mirror plate and the object.

Abstract: A spatial light modulator includes a mirror plate comprising a reflective upper surface, a lower surface, and a cavity having an opening on the lower surface; a substrate comprising an upper surface, a hinge support post in connection with the upper surface, and a hinge component supported by the hinge support post and in connection with the mirror plate; and a landing tip having a laterally extended upper portion and a vertically extended lower portion in connection with the substrate and the vertically extended lower portion. The laterally extended upper portion can contact the lower surface of the mirror plate to limit the rotation of the mirror plate. The hinge component extends into the cavity and can facilitate a rotation of the mirror plate.

Abstract: A micro structure includes a seed electrode layer on a substrate and a plurality of conductive layers on the seed electrode layer. The combined thickness of the seed electrode layer and the plurality of conductive layers can be more than 0.1 mm and the lateral dimensions of the seed electrode layer and the plurality of conductive layers vary less than 20% along the direction normal to a surface of the substrate and the micro structure has striations on an outer surface.

Abstract: A spatial light modulator includes a mirror plate comprising a reflective upper surface, a louver surface having a recess in the lower surface, a first cavity having an opening on the lower surface, and a cantilever situated under the recess and connected with the lower portion of the mirror plate. The mirror plate can tilt around a hinge component extending into the first cavity. The hinge component is supported by a stationary substrate. The tilt movement of the mirror plate can be stopped when the cantilever comes to contact with a stationary object.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: An encapsulated device includes a micro device on a substrate, a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device, and a desiccant material on the cover and in the chamber. An anti-stiction material is absorbed in the desiccant material.

Abstract: A method for packaging a micro device includes encapsulating a micro device in a chamber on a substrate, wherein the chamber is defined by spacer walls and an encapsulation cover, removing a portion of the encapsulation cover and portions of the spacer walls to expose a surfaces of the spacer walls, and forming a layer of a sealing material on the exposed surfaces of the spacer walls to hermetically seal the micro device in the chamber.

Abstract: A spatial light modulator includes a substrate; a hinge in connection with the substrate; a mirror plate that is connected with the hinge and is configured to tilt about the hinge; and a piezoelectric device coupled with the substrate. The piezoelectric device is configured to produce an acoustic wave to assist the separation between the mirror plate and the object.

Abstract: A spatial light modulator includes a mirror plate comprising a reflective upper surface, a louver surface having a recess in the lower surface, a first cavity having an opening on the lower surface, and a cantilever situated under the recess and connected with the lower portion of the mirror plate. The mirror plate can tilt around a hinge component extending into the first cavity. The hinge component is supported by a stationary substrate. The tilt movement of the mirror plate can be stopped when the cantilever comes to contact with a stationary object.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: Described are various optical, opto-electrical and electrical components and subsystems. Some embodiments include input and output waveguides supporting opposing facets separated by a gap. The degree to which the opposing facets are aligned with respect to one another controls the light intensity in the output waveguide. An active closed-loop control mechanism dynamically controls the extent of waveguide alignment to maintain a desired output intensity. In other embodiments, the path between opposing facets can be selectively blocked by a micro blade. Still other embodiments combine switching with optical power equalization for ease of integration.

Abstract: Described are various optical, opto-electrical and electrical components and subsystems. Micro-Electro-Mechanical Systems (MEMS) actuators that employ electrostatic combs adjust uniaxial, unidirectional or bidirectional mirrors between two basic positions with optical power control, one position for each of two switch configurations. Limiting the switching mirrors to two positions limits flexibility, but greatly reduces system cost and complexity, and simplifies beam alignment. In one embodiment, a frame surrounding the comb teeth maintains spacing between teeth to prevent electrical shorts.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: Fiber, lens and sensor arrays and their precision alignment for optical devices with free space light propagation is disclosed Fabrication methods of arrays and their assembly are also proposed. In one implementation, a device includes a fiber alignment module holding fibers in parallel to form a fiber array. The fiber alignment module includes first and second alignment plates, and a spacer plate engaged between the first and the second alignment plates. Each alignment plate includes an array of through holes to respectively hold the fibers. A lens array can be engaged to the fiber alignment module to align lenses to their corresponding fibers. Passive alignment features may be formed at interfacing surfaces of different layers to assist the alignment. Applications of these integrated fiber, lens and sensor arrays to optical cross connect switches and reconfigurable add drop multiplexers are also disclosed.

Abstract: Described are methods for fabricating Micro-Electro-Mechanical Systems (MEMS) actuators with hidden combs and hinges. The ability to hide the combs renders the actuators useful in digital micro-mirror devices. Comb actuators provide increased torque, which facilitates the use of stiffer, less fragile hinge structures. Also important, comb actuators do not require mechanical stops to define stable states, and thus avoid problems associated with physical contact. The actuators are infinitely variable through a range of angles.

Abstract: A magnetic recording system containing magnetic recording media with separate data and servo magnetic layers is disclosed. A servo magnetic layer resides usually below the data layer and has higher coercivity than that of the data layer. Interference between the data and servo signals is minimized by recording the servo patterns perpendicular or transverse direction with respect to the orientation of data bits. In addition, servo patterns are selected so that no interference with the data is generated by the servo pattern when the reader is in the middle of data tracks. Tracking error signals are approximately linear with track misregistration around the middle of data tracks. Finally, interference between the data and servo signals is further reduced by electronic processing. Continuous servo signals permit increased track densities with a single actuator and very high track densities with dual microactuator-actuator system.

Abstract: Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

Abstract: Variable optical attenuators that use a blade in a gap between two fibers to control the optical attenuation without having coupling optics in the gap, where the blade has at least one blade surface at an angle with respect to an end facet of one fiber.

Abstract: An optical disk drive having a cleaning mechanism to clean the optical head by contact with a selected surface or in close proximity of a surface of the storage medium.