Patents by Inventor Vlad Ocher

Vlad Ocher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040156736
    Abstract: A shaped charged liner for oil well perforating is made from composite metal powder of clusters of pre-agglomerated particles of a denser metal with an agglutinating metal which is press-molded or tap-molded into a near net-shape liner preform which is then sintered to form a sintered body which is hot-coined or forged to form the final shape liner. The powder is formed by different density metal particles which are preclustered.
    Type: Application
    Filed: October 23, 2003
    Publication date: August 12, 2004
    Inventors: Vlad Ocher, Frank J. Polese, Jack A. Rubin
  • Publication number: 20030131476
    Abstract: A heat-dissipating element for the packaging of microelectronic components wherein conduits of higher thermal conductivity material extend through material having a compatible thermal expansion to the microelectronic component material. The element is formed by a porous compact of a high melting temperature material having bores formed between a surface located close to the microchip and a surface for contacting a heat sink or other heat dissipator. The compact is then infiltrated with a lower melting point material having a high thermal conductivity, thereby filling the bores to form heat conduits extending between the surfaces. Further enhancements provide integrated heat reservoir and radiator structures.
    Type: Application
    Filed: September 26, 2002
    Publication date: July 17, 2003
    Inventors: Vlad Ocher, Inocencio I. Rico, Andre K. Miller, David L. Rose, Raymond J. Roszkowicz
  • Patent number: 6250127
    Abstract: A process for low cost manufacturing light-weight, heat-dissipating structures such as heatsinks, heat spreaders, and covers or lids for microelectronic components such as flip-chip integrated circuits from difficult-to-machine metal matrix composites such as aluminum silicon carbide (generically referred to as “Al—SiC” or “AlSiC”). The process involves selecting a mass produced quantity of Al—SiC material, forming that material into a thin ribbon, then stamping/coining the ribbon into the structures. The ribbon can be formed by extruding a thin strip from a billet of the Al—SiC material, then plurally rolling it. In this way, commonly available AlSiC composites manufactured in high volume for use in other applications such as cast automotive parts may be used.
    Type: Grant
    Filed: October 11, 1999
    Date of Patent: June 26, 2001
    Assignee: Polese Company, Inc.
    Inventors: Frank J. Polese, Jack A. Rubin, Michael J. Singer, Walter V. Chichra, Anthony P. Grodio, Vlad Ocher, Henry Escalante, William Dixon, David L. Rose, Stuart Weinshanker