Patents by Inventor Vladimir Gotlib

Vladimir Gotlib has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor cooling system and process for manufacturing the same
    Publication number: 20060208353
    Abstract: A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
    Type: Application
    Filed: May 23, 2006
    Publication date: September 21, 2006
    Applicant: DTNR LTD.
    Inventors: Eliezer Adar, Vladimir Gotlib
  • Semiconductor cooling system and process for manufacturing the same
    Patent number: 7067913
    Abstract: A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: June 27, 2006
    Assignee: DTNR Ltd.
    Inventors: Eliezer Adar, Vladimir Gotlib
  • Semiconductor cooling system and process for manufacturing the same
    Publication number: 20060033206
    Abstract: A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
    Type: Application
    Filed: August 13, 2004
    Publication date: February 16, 2006
    Applicant: DTNR LTD.
    Inventors: Eliezer Adar, Vladimir Gotlib