Abstract: The herein disclosed process comprises forming conductors of desired shape on a substrate comprised of a metal that is selectively etchable with respect to the metal of conductors, such that the conductors are formed on both sides of the substrate and that the conductors have at least one constricted portion at the substrate side opposite to that on which a base will be laminated. Then, the panel base is laminated onto the appropriate side of the substrate, and the substrate metal is etched selectively with respect to the conductor metal through the entire thickness of the substrate until the metal of the latter is fully removed from under the constricted portions only.