Abstract: Apparatus for Scanning Acoustic Microscopy (SAM) of a semiconductor device including a substrate with an acoustic probe, The substrate has upper and lower surfaces. A sealed lower space provides an environment surrounding the lower surface. An upper ring structure formed above the upper surface includes an upper sealing ring in contact with the upper surface, with the upper sealing structure and the seal forming a dam for retaining the acoustic transmission fluid above the upper surface. A fixture base retains a lower sealing ring in contact with the lower surface surrounding the lower surface. An acoustic scanning probe positioned confronting the upper surface of the semiconductor device extending into the acoustic transmission fluid retained in contact with the upper surface.

Abstract: Apparatus for Scanning Acoustic Microscopy (SAM) of a semiconductor device including a substrate with an acoustic probe, The substrate has upper and lower surfaces. A sealed lower space provides an environment surrounding the lower surface. An upper ring structure formed above the upper surface includes an upper sealing ring in contact with the upper surface, with the upper sealing structure and the seal forming a dam for retaining the acoustic transmission fluid above the upper surface. A fixture base retains a lower sealing ring in contact with the lower surface surrounding the lower surface. An acoustic scanning probe positioned confronting the upper surface of the semiconductor device extending into the acoustic transmission fluid retained in contact with the upper surface.

Abstract: A modular cassette cutter design with a unique blade retention system for making multiple, simultaneous cuts in elongated strip material. The blades are retained so that they can be individually replaced. The blade hardware is made accessible from one side of the tool for easy replacement. The cassette modules lend themselves for easy accommodation to different types of gasket material and shapes. The cassette module cutters are easily interchangeable to make end cuts or corner cuts, and may be combined in a single press to make different cuts simultaneously. Prefabricated gaskets may be cut using data from linear measurements of cover designs.

Abstract: A modular cassette cutter design with a unique blade retention system for making multiple, simultaneous cuts in elongated strip material. The blades are retained so that they can be individually replaced. The blade hardware is made accessible from one side of the tool for easy replacement. The cassette modules lend themselves for easy accommodation to different types of gasket material and shapes. The cassette module cutters are easily interchangeable to make end cuts or corner cuts, and may be combined in a single press to make different cuts simultaneously. Prefabricated gaskets may be cut using data from linear measurements of cover designs.

Abstract: A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.

Abstract: A system and method to form a reworkable compression seal between an electronic module and a cap are disclosed. The system and method include an electronic module having a tapered edge configured on at least a portion of the edge defining a perimeter of the electronic module and the cap configured with an opening to receive the electronic module therein. A compression seal is disposed with the cap and is configured to surround one or more chips or other electronic components on the electronic module to form a seal between the electronic module and the cap. A plurality of side loaders are operably coupled to the cap and aligned to receive the tapered edge on the electronic module. Each side loader is configured to engage the tapered edge and provide sufficient compressive force to the compression seal disposed between the electronic module and the cap.