Patents by Inventor Vladimir Machavariani

Vladimir Machavariani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240068964
    Abstract: A method, a system, and a non-transitory computer readable medium for evaluating x-ray signals. The method may include calculating an estimated field for each of multiple non-perturbed objects, the multiple non-perturbed objects represent perturbances of the perturbed object; the perturbances are of an order of a wavelength of the non-diffused x-ray signals; and evaluating the non-diffused x-ray signals based on the field of the multiple non-perturbed objects.
    Type: Application
    Filed: December 30, 2021
    Publication date: February 29, 2024
    Applicant: NOVA LTD.
    Inventors: Shahar Gov, Daniel Kandel, Heath POIS, Parker Lund, Michal Haim YACHINI, Vladimir Machavariani
  • Patent number: 11710616
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: July 25, 2023
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Publication number: 20230074398
    Abstract: A metrology method for use in determining one or more parameters of a patterned structure, the method including providing raw measured TEM image data, TEMmeas, data indicative of a TEM measurement mode, and predetermined simulated TEM image data including data indicative of one or more simulated TEM images of a structure similar to the patterned structure under measurements and a simulated weight map including weights assigned to different regions in the simulated TEM image corresponding to different features of the patterned structure, performing a fitting procedure between the raw measured TEM image data and the predetermined simulated TEM image data and determining one or more parameters of the structure from the simulated TEM image data corresponding to a best fit condition.
    Type: Application
    Filed: September 19, 2022
    Publication date: March 9, 2023
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Publication number: 20220326159
    Abstract: A method for use in measuring one or more characteristics of patterned structures, the method including providing measured data comprising data indicative of at least one Raman spectrum obtained from a patterned structure under measurements using at least one selected optical measurement scheme each with a predetermined configuration of at least one of illuminating and collected light conditions corresponding to the one or more characteristics to be measured, processing the measured data, and determining, for each of the at least one Raman spectrum, a distribution of Raman-contribution efficiency (RCE) within at least a part of the structure under measurements, being dependent on characteristics of the structure and the predetermined configuration of the at least one of illuminating and collected light conditions in the respective optical measurement scheme, and analyzing the distribution of Raman-contribution efficiency and determining the one or more characteristics of the structure.
    Type: Application
    Filed: March 15, 2022
    Publication date: October 13, 2022
    Applicant: NOVA LTD.
    Inventors: Gilad Barak, Yanir HAINICK, Yonatan OREN, Vladimir Machavariani
  • Publication number: 20220310356
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Application
    Filed: April 18, 2022
    Publication date: September 29, 2022
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Patent number: 11450541
    Abstract: A metrology method for use in determining one or more parameters of a patterned structure, the method including providing raw measured TEM image data, TEMmeas, data indicative of a TEM measurement mode, and predetermined simulated TEM image data including data indicative of one or more simulated TEM images of a structure similar to the patterned structure under measurements and a simulated weight map including weights assigned to different regions in the simulated TEM image corresponding to different features of the patterned structure, performing a fitting procedure between the raw measured TEM image data and the predetermined simulated TEM image data and determining one or more parameters of the structure from the simulated TEM image data corresponding to a best fit condition.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: September 20, 2022
    Assignee: NOVA LTD
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Patent number: 11309162
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: April 19, 2022
    Assignee: NOVA LTD
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Patent number: 11275027
    Abstract: A method for use in measuring one or more characteristics of patterned structures, the method including providing measured data comprising data indicative of at least one Raman spectrum obtained from a patterned structure under measurements using at least one selected optical measurement scheme each with a predetermined configuration of at least one of illuminating and collected light conditions corresponding to the one or more characteristics to be measured, processing the measured data, and determining, for each of the at least one Raman spectrum, a distribution of Raman-contribution efficiency (RCE) within at least a part of the structure under measurements, being dependent on characteristics of the structure and the predetermined configuration of the at least one of illuminating and collected light conditions in the respective optical measurement scheme, and analyzing the distribution of Raman-contribution efficiency and determining the one or more characteristics of the structure.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: March 15, 2022
    Assignee: NOVA LTD
    Inventors: Gilad Barak, Yanir Hainick, Yonatan Oren, Vladimir Machavariani
  • Publication number: 20210217581
    Abstract: A metrology method for use in determining one or more parameters of a three-dimensional patterned structure, the method including performing a fitting procedure between measured TEM image data of the patterned structure and simulated TEM image data of the patterned structure, determining a measured Lamellae position of at least one measured TEM image in the TEM image data from a best fit condition between the measured and simulated data, and generating output data indicative of the simulated TEM image data corresponding to the best fit condition to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Application
    Filed: February 9, 2021
    Publication date: July 15, 2021
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Patent number: 10916404
    Abstract: A control system is presented for use in measuring one or more parameters of a three-dimensional patterned structure. The control system is configured as a computer system comprising a data processor configured to receive and process raw measured TEM image data, TEMmeas, and generate output data indicative of one or more parameters of a patterned structure. The data processor comprises an optimization module configured and operable to utilize data indicative of one or more parameters of TEM measurement mode and perform a fitting procedure between the raw measured TEM image data, TEMmeas, and a predetermined simulated TEM image data, TEMsimui based on a parametrized three-dimensional model of features of the patterned structure, and generate simulated image data corresponding to a best fit condition, to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: February 9, 2021
    Assignee: NOVA MEASURING INSTRUMENTS LTD.
    Inventors: Vladimir Machavariani, Michael Shifrin, Daniel Kandel, Victor Kucherov, Igor Ziselman, Ronen Urenski, Matthew Sendelbach
  • Publication number: 20200294829
    Abstract: A control system for use in measuring one or more parameters of a patterned structure. The control system is configured as a computer system and comprises: an input utility configured to receive input data comprising raw measured TEM image data, TEMmeas, data indicative of a TEM measurement mode; and a data processor configured to process the raw measured TEM image data, TEMmeas, and generate output data indicative of one or more parameters of a patterned structure. The data processor comprises an optimization module configured and operable to utilize the data indicative of the TEM measurement mode and perform a fitting procedure between the raw measured TEM image data, TEMmeas, and predetermined simulated TEM image data, TEMsimul, and determine one or more parameters of the structure from the simulated image data corresponding to a best fit condition.
    Type: Application
    Filed: August 29, 2018
    Publication date: September 17, 2020
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Patent number: 10761036
    Abstract: Determining parameters of a patterned structure located on top of an underneath layered structure, where input data is provided which includes first measured data PMD being a function ƒ of spectral intensity I? and phase ?, PMD=ƒ(I?; ?), corresponding to a complex spectral response of the underneath layered structure, and second measured data Smeas indicative of specular reflection spectral response of a sample formed by the patterned structure and the underneath layered structure, and where a general function F is also provided describing a relation between a theoretical optical response Stheor of the sample and a modeled optical response Smodel of the patterned structure and the complex spectral response PMD of the underneath layered structure, such that Stheor=F(Smodel; PMD), where the general function is then utilized for comparing the second measured data Smeas and the theoretical optical response Stheor, and determining parameter(s) of interest of the top structure.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: September 1, 2020
    Assignee: NOVA MEASURING INSTRUMENTS LTD.
    Inventors: Boris Levant, Yanir Hainick, Vladimir Machavariani, Roy Koret, Gilad Barak
  • Publication number: 20200256799
    Abstract: A method for use in measuring one or more characteristics of patterned structures, the method including providing measured data comprising data indicative of at least one Raman spectrum obtained from a patterned structure under measurements using at least one selected optical measurement scheme each with a predetermined configuration of at least one of illuminating and collected light conditions corresponding to the one or more characteristics to be measured, processing the measured data, and determining, for each of the at least one Raman spectrum, a distribution of Raman-contribution efficiency (RCE) within at least a part of the structure under measurements, being dependent on characteristics of the structure and the predetermined configuration of the at least one of illuminating and collected light conditions in the respective optical measurement scheme, and analyzing the distribution of Raman-contribution efficiency and determining the one or more characteristics of the structure.
    Type: Application
    Filed: February 18, 2020
    Publication date: August 13, 2020
    Inventors: GILAD BARAK, YANIR HAINICK, YONATAN OREN, VLADIMIR MACHAVARIANI
  • Patent number: 10564106
    Abstract: A method and system are presented for use in measuring one or more characteristics of patterned structures. The method comprises: providing measured data comprising data indicative of at least one Raman spectrum obtained from a patterned structure under measurements using at least one selected optical measurement scheme each with a predetermined configuration of at least one of illuminating and collected light conditions corresponding to the characteristic(s) to be measured; processing the measured data, and determining, for each of the at least one Raman spectrum, a distribution of Raman-contribution efficiency (RCE) within at least a part of the structure under measurements, being dependent on characteristics of the structure and the predetermined configuration of the at least one of illuminating and collected light conditions in the respective optical measurement scheme; analyzing the distribution of Raman-contribution efficiency and determining the characteristic(s) of the structure.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: February 18, 2020
    Assignee: NOVA MEASURING INSTRUMENTS LTD.
    Inventors: Gilad Barak, Yanir Hainick, Yonatan Oren, Vladimir Machavariani
  • Publication number: 20190393016
    Abstract: A control system is presented for use in measuring one or more parameters of a three-dimensional patterned structure. The control system is configured as a computer system comprising a data processor configured to receive and process raw measured TEM image data, TEMmeas, and generate output data indicative of one or more parameters of a patterned structure. The data processor comprises an optimization module configured and operable to utilize data indicative of one or more parameters of TEM measurement mode and perform a fitting procedure between the raw measured TEM image data, TEMmeas, and a predetermined simulated TEM image data, TEMsimui based on a parametrized three-dimensional model of features of the patterned structure, and generate simulated image data corresponding to a best fit condition, to thereby enable determination therefrom of the one or more parameters of the structure.
    Type: Application
    Filed: February 27, 2018
    Publication date: December 26, 2019
    Inventors: VLADIMIR MACHAVARIANI, MICHAEL SHIFRIN, DANIEL KANDEL, VICTOR KUCHEROV, IGOR ZISELMAN, RONEN URENSKI, MATTHEW SENDELBACH
  • Publication number: 20190317024
    Abstract: Determining parameters of a patterned structure located on top of an underneath layered structure, where input data is provided which includes first measured data PMD being a function ƒ of spectral intensity I? and phase ?, PMD=ƒ(I?; ?), corresponding to a complex spectral response of the underneath layered structure, and second measured data Smeas indicative of specular reflection spectral response of a sample formed by the patterned structure and the underneath layered structure, and where a general function F is also provided describing a relation between a theoretical optical response Stheor of the sample and a modeled optical response Smodel of the patterned structure and the complex spectral response PMD of the underneath layered structure, such that Stheor=F(Smodel; PMD), where the general function is then utilized for comparing the second measured data Smeas and the theoretical optical response Stheor, and determining parameter(s) of interest of the top structure.
    Type: Application
    Filed: April 30, 2019
    Publication date: October 17, 2019
    Inventors: Boris Levant, Yanir Hainick, Vladimir Machavariani, Roy Koret, Gilad Barak
  • Patent number: 10274435
    Abstract: A data analysis method and system are presented for use in determining one or more parameters of a patterned structure located on top of an underneath layered structure. According to this technique, input data is provided which includes first measured data PMD being a function ƒ of spectral intensity I? and phase ?, PMD=ƒ(I?;?), corresponding to a complex spectral response of the underneath layered structure, and second measured data Smeas indicative of specular reflection spectral response of a sample formed by the patterned structure and the underneath layered structure. Also provided is a general function F describing a relation between a theoretical optical response Stheor of the sample and a modeled optical response Smodel of the patterned structure and the complex spectral response PMD of the underneath layered structure, such that Stheor=F(Smodel; PMD).
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: April 30, 2019
    Assignee: NOVA MEASURING INSTRUMENTS LTD.
    Inventors: Boris Levant, Yanir Hainick, Vladimir Machavariani, Roy Koret, Gilad Barak
  • Publication number: 20180372644
    Abstract: A method and system are presented for use in measuring one or more characteristics of patterned structures. The method comprises: providing measured data comprising data indicative of at least one Raman spectrum obtained from a patterned structure under measurements using at least one selected optical measurement scheme each with a predetermined configuration of at least one of illuminating and collected light conditions corresponding to the characteristic(s) to be measured; processing the measured data, and determining, for each of the at least one Raman spectrum, a distribution of Raman-contribution efficiency (RCE) within at least a part of the structure under measurements, being dependent on characteristics of the structure and the predetermined configuration of the at least one of illuminating and collected light conditions in the respective optical measurement scheme; analyzing the distribution of Raman-contribution efficiency and determining the characteristic(s) of the structure.
    Type: Application
    Filed: December 15, 2016
    Publication date: December 27, 2018
    Inventors: GILAD BARAK, YANIR HAINICK, YONATAN OREN, VLADIMIR MACHAVARIANI
  • Publication number: 20180052119
    Abstract: A data analysis method and system are presented for use in determining one or more parameters of a patterned structure located on top of an underneath layered structure. According to this technique, input data is provided which includes first measured data PMD being a function ƒ of spectral intensity I? and phase ?, PMD=ƒ(I?;?), corresponding to a complex spectral response of the underneath layered structure, and second measured data Smeas indicative of specular reflection spectral response of a sample formed by the patterned structure and the underneath layered structure. Also provided is a general function F describing a relation between a theoretical optical response Stheor of the sample and a modeled optical response Smodel of the patterned structure and the complex spectral response PMD of the underneath layered structure, such that Stheor=F(Smodel; PMD).
    Type: Application
    Filed: November 2, 2015
    Publication date: February 22, 2018
    Inventors: Boris LEVANT, Yanir HAINICK, Vladimir MACHAVARIANI, Roy KORET, Gilad BARAK
  • Patent number: 7187456
    Abstract: A method for measuring at least one desired parameter of a patterned structure having a plurality of features defined by a certain process of its manufacturing. The structure represents a grid having at least one cycle formed of at least two metal-containing regions spaced by substantially transparent regions with respect to incident light defining a waveguide. An optical model is provided, which is based on at least some of the features of the structure defined by a certain process of its manufacturing, and on the relation between a range of the wavelengths of incident radiation to be used for measurements and a space size between the two metal-containing regions in the grid cycle, and a skin depth of said metal. The model is capable of determining theoretical data representative of photometric intensities of light components of different wavelengths specularly reflected from the structure and of calculating said at least one desired parameter of the structure.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: March 6, 2007
    Assignee: Nova Measuring Instruments Ltd.
    Inventors: David Scheiner, Vladimir Machavariani