Abstract: The present invention relates to electronics and particularly to field emitters used in M-type microwave devices. The design of a multi-layer field emitter is proposed which has at least one operating film and supporting films, providing mechanical strength and preventing penetration of corrosion materials into the operating film at high operating temperatures. The supporting films could be produced from the same material or material with linear expansion coefficients equal or close to that of the operating film material. Built-in mechanical stress can cause not only deformation but also a break of the film during its exploitation in a wide range of temperatures. In the inventive structure the thermal stresses in the operating film during an emission from its surface are lower due to good thermal contact with supporting films.

Abstract: The present invention relates to electronics and particularly to field emitters used in M-type microwave devices. The design of a multi-layer field emitter is proposed which has at least one operating film and supporting films, providing mechanical strength and preventing penetration of corrosion materials into the operating film at high operating temperatures. The supporting films could be produced from the same material or material with linear expansion coefficients equal or close to that of the operating film material. Built-in mechanical stress can cause not only deformation but also a break of the film during its exploitation in a wide range of temperatures. In the inventive structure the thermal stresses in the operating film during an emission from its surface are lower due to good thermal contact with supporting films.

Abstract: The present invention relates to electronics and particularly to field emitters used in M-type microwave devices. The design of a multi-layer field emitter is proposed which has at least one operating film and supporting films, providing mechanical strength and preventing penetration of corrosive materials into the operating film at high operating temperatures. The supporting films could be produced from the same material or material with linear expansion coefficients equal or close to that of the operating film material. Built-in mechanical stress can cause not only deformation but also a break of the film during its exploitation in a wide range of temperatures. In the inventive structure the thermal stresses in the operating film during an emission from its surface are lower due to good thermal contact with supporting films.

Abstract: The present invention relates to magnetrons and is aimed to improve effectiveness of using a working surface of field-electron emitters, to improve reliability of devices under conditions of increased mechanical action. These objects are solved in the design of a magnetron, comprising an anode and a cathode disposed co-axially inside the anode, the cathode comprising a secondary-electron emitter; a field-electron emitter and lateral flanges functioning as focusing shields, wherein at least one of the focusing shields is located from the secondary-electron emitter and comprises at least one field-electron emitter with a working end-face thereof facing the surface of the secondary-electron emitter.

Abstract: The present invention relates to M-type microwave devices and is aimed to improve effectiveness of using a working surface of field-electron emitters, to improve their reliability while increasing stability of field emission and service life of the device. These objects are solved in the design of a M-type microwave device, comprising an anode encircling a cylindrical evacuated cavity and a cathode assembly disposed co-axially inside the anode, said cathode assembly comprising a cylindrical rod with its surfaces having elements in the form of planar (film) field-electron emitters and secondary-electron emitters that provide a primary and a secondary electron emission, respectively. In doing so, the normal to planar field-electron emitters is not parallel and makes therewith an angle of more than 0 degrees. An end-face of the field-electron emitter is protected by a tunnel-thin dielectric layer containing impurities of various materials and materials having a low work function.