Abstract: A dry film photoresist consisting of a two-layer base incorporating a solid polymeric substrate with a thickness of from 15 to 100.mu. and an intermediate polymeric layer with a thickness of from 3 to 15.mu. transparent to UV-radiation within the range of from 300 to 400 nm, a light-sensitive layer with a thickness of from 4 to 20.mu. and a protective polymeric film with a thickness of from 5 to 50.mu.. All four of these layers are bonded therebetween by adhesion forces so that the adhesion of the protective polymeric film to the light-sensitive layer is less than the cohesion strength of the light-sensitive layer; the adhesion of the solid polymeric substrate to the intermediate polymeric layer is less than the adhesion of the intermediate polymeric layer to the light-sensitive layer and the adhesion force of each of the three above-mentioned layers is less than the cohesion strength of each of said layers.

Abstract: A dry film photosensitive resist, according to the invention, is a flexible laminated structure consisting of three layers of which the first is a transparent polymer film transmitting UV radiation and having a thickness of 5-100.mu.; the second of said layers being a light-sensitive layer having a thickness of 5-1,000.mu. and comprising a combination of a carboxyl-containing polymer-thickener, a polar oligomer, and a monomeric substance having a boiling point above 200.degree. C. at 760 mm Hg; the third of the layers being a film from a polymeric substance having a thickness of 5-100.mu., the last-mentioned layer being a protective layer for the light sensitive layer and being disposed thereon. All the three layers are adhesively bonded together. The light-sensitive layer contains as the carboxyl-containing polymer thickener, a water insoluble copolymer of a monomer or a mixture of monomers having a neutral reaction with the carboxyl-containing monomer.