Abstract: An open modular speaker assembly is configured to be inserted into a mobile wireless device and includes a frame, a magnetic assembly that is disposed within the frame and a membrane assembly disposed within the frame and in proximity to the magnetic assembly. Actuation of the magnetic assembly by an electric current causes a movement of the magnetic assembly causing a resultant movement of the membrane assembly. A first portion of the mobile wireless device and the membrane assembly form a front volume where the resultant movement of the membrane assembly produces sound in the front volume, and such that a second portion of the mobile wireless device and the membrane assembly form a back volume that is separated from the front volume by the membrane assembly. Air is displaced or exchanged between the front volume and the back volume.

Abstract: A frequency controlled oscillator (100) is manufactured using an array (200) of mechanically interconnected oscillator bases (110) having component cavities (130) and wiring patterns therein. A frequency control component (120) serves as a cover for a cavity within the array, and in addition is electrically connected to oscillator components (140, 150) mounted within the cavity to regulate the frequency of electrical oscillation. Both the oscillator bases and finished oscillators may be tested while still in the array, prior to being separated from each other. In a most preferred embodiment, the array of oscillator bases are manufactured from a polymeric sheet material laminated with electrically conductive traces. The polymeric sheet material is selectively punched or formed prior to lamination so that intermediate and upper layers (112, 113) have predetermined sections removed.

Abstract: A frequency controlled oscillator (100) is manufactured using an array (200) of mechanically interconnected oscillator bases (110) having component cavities (130) and wiring patterns therein. A frequency control component (120) serves as a cover for a cavity within the array, and in addition is electrically connected to oscillator components (140, 150) mounted within the cavity to regulate the frequency of electrical oscillation. Both the oscillator bases and finished oscillators may be tested while still in the array, prior to being separated from each other. In a most preferred embodiment, the array of oscillator bases are manufactured from a polymeric sheet material laminated with electrically conductive traces. The polymeric sheet material is selectively punched or formed prior to lamination so that intermediate and upper layers (112, 113) have predetermined sections removed.

Abstract: A temperature compensation circuit (10) for a crystal oscillator module (12) used in a communication device (200). An existing microcontroller (210) of the communication device (200) is used to provide temperature compensating digital data (30) for a crystal oscillator (18). In this way, the crystal oscillator module (12) does not require an on-board memory which substantially cuts costs. The temperature compensation digital data (30) is converted to a temperature compensation signal (22) in a digital-to-analog converter which controls the crystal oscillator frequency. However, typical digital-to-analog converters are driven by voltage regulators which vary over temperature.