Abstract: A method for laser drilling and laser cutting of semiconductor material or glass in pulsed regime permits, for a given laser power, a rate of material cutting which is substantially higher than the rate obtained using conventional laser cutting. The hole or cut produced by the laser-induced removal of material has a reproducible shape, the drilling or cutting does not produce material debris or spatter deposition around the crater or cut, and the cracking of the crater or cut walls is prevented. The method includes utilization of a unique physical model representing all main physical processes taking place during laser-assisted material deposition, a corresponding mathematical model consisting of equations describing the relevant physical processes, and a computer code used for numerical calculations of the parameters of interest according to the mathematical model.

Abstract: A method for simulation of laser free form fabrication of parts and laser cladding with metal powder or wire includes absorption of laser beam at the surface exposed to metal powder particle jet, enthalpy influx into the part surface due to powder injection, 3D transient conductive heat transfer in the part, material loss due to evaporation, 3D melt pool surface shape determined by surface tension and gravity, 3D shape of the melt pool bottom, interaction of laser beam with the metal powder jet (heating of powder particles and attenuation of laser beam in powder cloud), and shape of part build up due to addition of metal material.