Patents by Inventor VMK Sarma Vedhanabhatla

VMK Sarma Vedhanabhatla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230035081
    Abstract: A thermally conductive band can improve the flow of heat from a first portion of a mobile computing device (e.g., the base portion of a laptop computer) to a second portion of the mobile computing device (e.g., the lid portion of the laptop). The band is removably attachable to the mobile computing device via magnets or another attachment approach. The band comprises a thermally conductive layer, a first end removably attachable to an external surface of the first device portion, and a second end removably attachable to an external surface of the second device portion. The band can comprise thermal gap pads between the thermally conductive layer and the external surfaces to aid in providing a low thermal resistance path between the device and the band.
    Type: Application
    Filed: September 29, 2022
    Publication date: February 2, 2023
    Applicant: Intel Corporation
    Inventors: Smit Kapila, VMK Sarma Vedhanabhatla, Vikas Kundapura Rao, David Rittenhouse