Abstract: An electronic assembly includes a chassis having electronic module mounting positions, each having an electronic module received therein. A module recess is adjacent a first end of the electronic module and a module roller is adjacent a second end. A sealing retainer is coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with a chassis cooling gas passageway and a module cooling gas passageway. The sealing retainer includes a rigid retainer body having a retainer recess adjacent a first end to receive the module roller when the electronic module is in an inserted position. A retainer roller is received in a module recess and a compressible retainer body is between the rigid retainer body and the chassis.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions. Each mounting position may have associated therewith a chassis liquid dual-flow connector. A respective electronic module may be received in each electronic module mounting position and include a circuit board, a liquid cooling path associated with the circuit board, and a module liquid dual-flow connector coupled to the liquid cooling path and configured to be mateable with the chassis liquid dual-flow connector.

Abstract: A sealing retainer may be coupled between a chassis and an electronic module. The sealing retainer includes a retainer body to be coupled to the chassis and a first cooling gas passageway that may be aligned with a chassis cooling gas passageway. A gas seal body has a second cooling gas passageway aligned with the first cooling gas passageway and coupled to the retainer body and movable between a retracted position that permits insertion and removal of the electronic module and an extended position that seals against the electronic module.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions and respective electronic modules received in each electronic module mounting position. A respective retainer may be coupled between the chassis and each electronic module. Each retainer may include a retainer body coupled to the chassis, and a liquid coupling body carried by the retainer body and movable between retracted and extended positions permitting insertion and removal of the electronic module. The liquid coupling body may have a retainer liquid outlet and a retainer liquid inlet configured to engage a module liquid inlet and module liquid outlet, respectively, when moved from the retracted position to the extended position.

Abstract: An electronic device may include an electronic circuit, a heat sink thermally coupled to the electronic circuit, and spaced apart cooling fins extending from the heat sink. Each cooling fin includes a circuit board and a cooling device mounted thereon. The cooling device may have a conductive trace layer on the circuit board defining an electromagnet, a mounting member extending upwardly from the circuit board, a fan blade coupled to an upper end of the mounting member to be movable in a rocking motion about an axis defined by the mounting member, and a permanent magnet carried by the fan blade and responsive to the electromagnet.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions. Each mounting position may have associated therewith a chassis liquid dual-flow connector. A respective electronic module may be received in each electronic module mounting position and include a circuit board, a liquid cooling path associated with the circuit board, and a module liquid dual-flow connector coupled to the liquid cooling path and configured to be mateable with the chassis liquid dual-flow connector.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions and respective electronic modules received in each electronic module mounting position. A respective retainer may be coupled between the chassis and each electronic module. Each retainer may include a retainer body coupled to the chassis, and a liquid coupling body carried by the retainer body and movable between retracted and extended positions permitting insertion and removal of the electronic module. The liquid coupling body may have a retainer liquid outlet and a retainer liquid inlet configured to engage a module liquid inlet and module liquid outlet, respectively, when moved from the retracted position to the extended position.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.

Abstract: An electronic assembly includes a chassis having electronic module mounting positions, each having an electronic module received therein. A module recess is adjacent a first end of the electronic module and a module roller is adjacent a second end. A sealing retainer is coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with a chassis cooling gas passageway and a module cooling gas passageway. The sealing retainer includes a rigid retainer body having a retainer recess adjacent a first end to receive the module roller when the electronic module is in an inserted position. A retainer roller is received in a module recess and a compressible retainer body is between the rigid retainer body and the chassis.

Abstract: A sealing retainer may be coupled between a chassis and an electronic module. The sealing retainer includes a retainer body to be coupled to the chassis and a first cooling gas passageway that may be aligned with a chassis cooling gas passageway. A gas seal body has a second cooling gas passageway aligned with the first cooling gas passageway and coupled to the retainer body and movable between a retracted position that permits insertion and removal of the electronic module and an extended position that seals against the electronic module.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

Abstract: An electronic device may include an electronic circuit, a heat sink thermally coupled to the electronic circuit, and spaced apart cooling fins extending from the heat sink. Each cooling fin includes a circuit board and a cooling device mounted thereon. The cooling device may have a conductive trace layer on the circuit board defining an electromagnet, a mounting member extending upwardly from the circuit board, a fan blade coupled to an upper end of the mounting member to be movable in a rocking motion about an axis defined by the mounting member, and a permanent magnet carried by the fan blade and responsive to the electromagnet.

Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.

Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.

Abstract: Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.