Abstract: An apparatus and method for fitting at least one web that is driven continuously through the device with transponders, in addition to a method for printing said web. At least one unit (12, 13, 14) is integrated into the device (1) for the continuous transfer of individual transponders (10) or transponder parts (10a), which operate according to the radio frequency identification principle, from at least one continuous carrier belt (8) to the web (2). During the process, the running speed of the carrier belt (8) is adapted to the running speed of the web (2), the latter speed being predetermined by the printing process. A connection device (11, 11a, 11b, 11c) connects the transponders (10) or transponder parts (10a) to the web (2) in a predetermined section of the carrier belt (8) and the web (2), when the speeds have been synchronised.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.

Abstract: The invention relates to a method of singulating thin chips from a sawn wafer, comprising the steps of glueing the wafer first onto a carrier and sawing it then into individual chips on said carrier. Subsequently, the chips are detached from the carrier individually or in groups. The method is so conceived that carrier is a rigid board and the adhesive is heat-soluble, the adhesive being deactivated with the aid of heat passing either through the chip itself or through the carrier prior to the detachment of said chips, whereupon the respective chip is detached.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.