Abstract: The invention relates to a controlled polymerization method for producing ABA-triblock copolymers on the basis of (meth)acrylate with A-blocks which have a narrow, monomodal molecular weight distribution and a B-block which has a bimodal molecular weight distribution, and to the use thereof as binders in glues and sealing materials.

Abstract: The invention relates to a controlled polymerization method for producing ABA-triblock copolymers on the basis of (meth)acrylate with A-blocks having a narrow, monomodal molecular weight distribution, and a B-block having a wide, monomodal molecular weight distribution. The invention further relates to the use thereof as binders in glues or sealing compounds.

Abstract: The invention relates to a controlled polymerization process for preparing (meth)acrylate-based AB diblock copolymers with a B block which has a narrow monomodal molecular weight distribution, and an A block which has a broad monomodal molecular weight distribution, and to the use thereof, for example, as a binder in adhesives or sealants.

Abstract: The invention relates to a controlled polymerization process for preparing (meth)acrylate-based AB diblock copolymers with a B block which has a narrow monomodal molecular weight distribution, and an A block which has a broad bimodal molecular weight distribution, and to the use thereof, for example, as a binder in adhesives or sealants.

Abstract: The present invention relates to a polymer latex made by free-radical emulsion polymerization comprising polymer particles containing structural units derived from at least one conjugated diene component, whereby said polymer particles comprise at least one hard phase segment and at least one soft phase segment, wherein the polymer latex is particularly suitable for the production of dip-molded articles. Furthermore, the present invention relates to a process for making such a polymer latex, to the use of said polymer latex for the production of dip-molded articles, to a compounded polymer latex composition that is suitable for the production of dip-molded articles, to a method for making dip-molded latex articles, as well as to the latex articles obtained thereby.

Abstract: Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C3 to C20-?-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100%, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0° C. to 25° C., measured as the ratio of the storage modulus E? according to (E?0C?E?25C)/E?25C<1.5.

Abstract: The present invention relates to a polymer latex made by free-radical emulsion polymerization comprising polymer particles containing structural units derived from at least one conjugated diene component, whereby said polymer particles comprise at least one hard phase segment and at least one soft phase segment, wherein the polymer latex is particularly suitable for the production of dip-molded articles. Furthermore, the present invention relates to a process for making such a polymer latex, to the use of said polymer latex for the production of dip-molded articles, to a compounded polymer latex composition that is suitable for the production of dip-molded articles, to a method for making dip-molded latex articles, as well as to the latex articles obtained thereby.

Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.

Abstract: The invention relates to a controlled polymerization method for producing ABA-triblock copolymers on the basis of (meth)acrylate with A-blocks having a narrow, monomodal molecular weight distribution, and a B-block having a wide, monomodal molecular weight distribution. The invention further relates to the use thereof as binders in glues or sealing compounds.

Abstract: The invention relates to a controlled polymerization process for preparing (meth)acrylate-based AB diblock copolymers with a B block which has a narrow monomodal molecular weight distribution, and an A block which has a broad monomodal molecular weight distribution, and to the use thereof, for example, as a binder in adhesives or sealants.

Abstract: The invention relates to a controlled polymerization method for producing telechelics on the basis of (meth)acrylate, which have a wide, monomodal molecular weight distribution, and to the use thereof as binders in glues or sealing materials.

Abstract: The invention relates to a process for preparing CABAC or ACBCA pentablock copolymers based on (meth)acrylate with an OH functionalization of the A blocks.

Abstract: The invention relates to a controlled polymerization process for preparing (meth)acrylate-based AB diblock copolymers with a B block which has a narrow monomodal molecular weight distribution, and an A block which has a broad bimodal molecular weight distribution, and to the use thereof, for example, as a binder in adhesives or sealants.

Abstract: Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C3 to C20 -?-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100%, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0° C. to 25° C., measured as the ratio of the storage modulus E? according to (E?0C?E?25C)/E?25C<1.5.

Abstract: The invention relates to a controlled polymerization method for producing telechelics on the basis of (meth)acrylate, which have a bimodal molecular weight distribution, and to the use thereof as binders in glues or sealing compounds.

Abstract: The invention relates to a controlled polymerization method for producing ABA-triblock copolymers on the basis of (meth)acrylate with A-blocks which have a narrow, monomodal molecular weight distribution and a B-block which has a bimodal molecular weight distribution, and to the use thereof as binders in glues and sealing materials

Abstract: The invention relates to block copolymers produced by means of controlled polymerization and that have at least one block A or B comprising (meth)acrylate monomers and copolymerizable monomers, and a block P on the basis of functionalized polymers.

Abstract: The invention relates to a process for preparing CABAC or ACBCA pentablock copolymers based on (meth)acrylate with an OH functionalization of the A blocks.

Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.

Abstract: A radiation curable hot-melt adhesive is provided which contains a polyurethane polymer. This polyurethane polymer is prepared from A) a reactive polyurethane prepolymer which contains at least two NCO groups, B) a low molecular weight compound which comprises a free-radically polymerizable double bond and a functional group which reacts with a NCO group; C) a compound which comprises a functional group which reacts with a NCO group, but does not comprise a functional group polymerizable under free-radical condition; and D) a free-radical photoinitiator which contains a primary or secondary alcohol functional group. The radiation curable hot-melt adhesive is suitable as tapes, films, labels or articles for medical use with pressure-sensitively adhesive layers, in particular, for adhesively bonding shrinkable labels on rotationally symmetrical containers.