Patents by Inventor Volker Hansel

Volker Hansel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11703541
    Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: July 18, 2023
    Inventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
  • Patent number: 11693050
    Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: July 4, 2023
    Inventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
  • Publication number: 20220155365
    Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
    Type: Application
    Filed: November 12, 2021
    Publication date: May 19, 2022
    Applicant: MPI Corporation
    Inventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
  • Publication number: 20220155366
    Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
    Type: Application
    Filed: November 12, 2021
    Publication date: May 19, 2022
    Applicant: MPI Corporation
    Inventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
  • Patent number: 7671615
    Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: March 2, 2010
    Assignee: SUSS MicroTec Tech Systems GmbH
    Inventors: Carel van de Beek, Stefan Kreissig, Volker Hansel, Sebastian Giessmann, Frank-Michael Werner, Claus Dietrich, Jorg Kiesewetter
  • Publication number: 20100029022
    Abstract: In a method for producing semiconductor components, in which chips are structured, tested, and isolated into dies on a wafer, in the event of a wafer being broken during the method, undamaged chips of a fragment of the wafer delimited by at least one edge section and at least one fracture contour are processed further as usual. The method has the result that the yield of usable chips is significantly increased in relation to the discarding and disposal of broken wafers provided in the prior art. The average production costs of electronic components and the loss of valuable semiconductor materials and the costs for the disposal of the fragments viewed as discards up to this point are thus significantly reduced.
    Type: Application
    Filed: February 4, 2008
    Publication date: February 4, 2010
    Applicant: SUSS MicroTec Test Systems GmbH
    Inventors: Frank FEHRMANN, Juliane Busch, Volker Hansel, Daniel Ouellette, Stojan Kanev
  • Publication number: 20080042679
    Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.
    Type: Application
    Filed: August 16, 2007
    Publication date: February 21, 2008
    Applicant: SUSS MicroTec Test Systems GmbH
    Inventors: Carel van de Beek, Stefan Kreissig, Volker Hansel, Sebastian Giessmann, Frank-Michael Werner, Claus Dietrich, Jorg Kiesewetter