Patents by Inventor Volker Harr

Volker Harr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060137169
    Abstract: A process for machining a blank from all directions with a machine tool, such as a milling machine, involves the machining from all directions being based on a three-dimensional template. In a first step, the three-dimensional form and, if need be, also the surface finish of the three-dimensional template may be automatically measured, and the associated data may be saved. In a second step, a blank may be held by at least one clamping adapter and a first region is brought into its final, ready to use partial form by the machine tool or the milling machine using said data for numerical control. In a third step, the partially machined blank may be held by at least one clamping adapter in the first, finally machined region and the remaining region may be brought into its final, ready to use overall form by the same machine tool or milling machine.
    Type: Application
    Filed: July 29, 2005
    Publication date: June 29, 2006
    Inventors: Hans Boehm, Volker Harr, Josef Scherer
  • Patent number: 6147505
    Abstract: An adapter arrangement for electrically testing printed circuit boards consists of two probe adapters with a uniform grid separation of the probes and two translator foils on whose sides facing the probe adapters there are contact areas with the pitch of the probe adapter. On the sides facing the printed circuit board, the arrangement of the contact areas and the contact points located thereon is the same as the grid on the printed circuit board under test. Between the translator foils a vacuum is generated with the help of rubber seals, a through hole, a valve and a suction hose. This vacuum creates a rigid package which permits good contact with the probes on both sides. The inserted support layers, which can be conventional printed circuit boards, prevent the translator foils from buckling. The various types of extremely complex printed circuit board can be electrically tested rapidly and cheaply using this arrangement.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: November 14, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Albert Ott, Wilhelm Tamm, Steffen Laur, Volker Harr