Patents by Inventor Volker Pieper

Volker Pieper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240123884
    Abstract: A function-adapted three-dimensional foam structure (2) for a vehicle seat (4) has first foam structure planes (6) to ensure a constant compressive strength of the foam structure (2) in two spatial directions x, y, second foam structure planes (8) to ensure a length variance of the foam structure (2) in a spatial direction z, that is perpendicular to the spatial directions x and y. The first foam structure planes (6) and the second foam structure planes (8) are formed and distributed within the foam structure (2) such that the compressive strength of the foam structure (2) is constant in the spatial directions x, y independent of the length-wise expansion of the foam structure (2) in the spatial direction z.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 18, 2024
    Inventors: Rainer Seitner, Ulrich Aschenbrenner, Max Pieper, Volker Sieber, Carsten Frank
  • Publication number: 20020110674
    Abstract: A process for the production of electrically conductive layers on the surface of plastics in which the surface of a plastic filled with electrically conductive constituents is irradiated with laser energy in such a way that the plastic is evaporated down to a predetermined depth at the point of incidence by the laser energy, leaving behind the electrically conductive constituents, which increase in concentration and thus form an electrically conductive layer. With the aid of the process, plastic moldings with integrated electrically conductive layers or tracks on the surface can be produced, for example components used in the electrical and electronics industries or other large or small plastic parts of any desired shape which are provided with conductive elements in certain places. The molding can also be a constituent of a composite article with other materials.
    Type: Application
    Filed: April 12, 2002
    Publication date: August 15, 2002
    Inventors: Frank Reil, Volker Pieper, Kai-Uwe Tonnes
  • Patent number: 6417486
    Abstract: A process for the production of electrically conductive layers on the surface of plastics in which the surface of a plastic filled with electrically conductive constituents is irradiated with laser energy in such a way that the plastic is evaporated down to a predetermined depth at the point of incidence by the laser energy, leaving behind the electrically conductive constituents, which increase in concentration and thus form an electrically conductive layer. With the aid of the process, plastic moldings with integrated electrically conductive layers or tracks on the surface can be produced, for example components used in the electrical and electronics industries or other large or small plastic parts of any desired shape which are provided with conductive elements in certain places. The molding can also be a constituent of a composite article with other materials.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: July 9, 2002
    Assignee: Ticona GmbH
    Inventors: Frank Reil, Volker Pieper, Kai-Uwe Tönnes
  • Publication number: 20020046996
    Abstract: A process for the production of electrically conductive layers on the surface of plastics in which the surface of a plastic filled with electrically conductive constituents is irradiated with laser energy in such a way that the plastic is evaporated down to a predetermined depth at the point of incidence by the laser energy, leaving behind the electrically conductive constituents, which increase in concentration and thus form an electrically conductive layer. With the aid of the process, plastic moldings with integrated electrically conductive layers or tracks on the surface can be produced, for example components used in the electrical and electronics industries or other large or small plastic parts of any desired shape which are provided with conductive elements in certain places. The molding can also be a constituent of a composite article with other materials.
    Type: Application
    Filed: October 18, 2001
    Publication date: April 25, 2002
    Inventors: Frank Reil, Volker Pieper, Kai-Uwe Tonnes