Patents by Inventor Volker Rohde

Volker Rohde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier element for a semiconductor chip
    Patent number: 6326683
    Abstract: A carrier element for a semiconductor chip which can be incorporated in smart cards and soldered onto circuit boards using SMD technology. For this purpose, a copper lamination of a plastic sheet is structured by etching in such a way that contact areas are formed in one piece with conductor tracks which end at the edge of the carrier element and enable reliable soldering.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: December 4, 2001
    Assignee: Siemens Aktiengesellschaft
    Inventors: Detlef Houdeau, Michael Huber, Volker Rohde, Richard Scheuenpflug, Peter Stampka
  • Process for producing polyacrylates having a low content of residual acrylate monomers
    Patent number: 5973107
    Abstract: The present invention relates to a process for producing a polyacrylate resin having a residual acrylate monomer content of <0.1% by weight, based on resin solids, by preparing an initial polyacrylate resin and subsequently polymerizing this initial polyacrylate resin in the presence of a monomer having a low vapor pressure, such as maleic anhydride, and a peroxide initiator to reduce the monomer content.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: October 26, 1999
    Assignee: Bayer Aktiengesellschaft
    Inventors: Dieter Margotte, Christian Wamprecht, Josef Pedain, Hartwig Hocker, Volker Rohde