Abstract: A bi-directional converter for converting voltage bi-directionally between a high voltage bus and a low voltage bus, having a switching converter connected across the high voltage bus, the switching converter having first and second switching modules connected in series across the high voltage bus, a switched node disposed between the switching modules being coupled to an inductor, the first and second switching modules being controllable so that the switching converter can be operated as a buck converter or a boost converter depending upon the direction of conversion from the high voltage bus to the low voltage bus or vice versa; the mid-voltage bus being coupled to a first full bridge switching circuit having two pairs of series connected switches with switched nodes between each of the pairs of switches being connected across a first winding of a transformer having a preset turns ratio.

Abstract: A bi-directional converter for converting voltage bi-directionally between a high voltage bus and a low voltage bus, comprising a switching converter connected across the high voltage bus, the switching converter comprising first and second switching modules connected in series across the high voltage bus, a switched node disposed between the switching modules being coupled to an inductor, the inductor connected to a first capacitor, the connection between the inductor and the first capacitor comprising a mid-voltage bus, the first and second switching modules being controllable so that the switching converter can be operated as a buck converter or a boost converter depending upon the direction of conversion from the high voltage bus to the low voltage bus or vice versa; the mid-voltage bus being coupled to a first full bridge switching circuit comprising two pairs of series connected switches with switched nodes between each of the pairs of switches being connected across a first winding of a transformer hav

Abstract: A three phase invertor has five coplanar leadframes for 2d-c terminals and 3a-c terminals. Power MOSFETs soldered around the periphery of one of the d-c leadframes are wire bonded to adjacent ones of the 3a-c leadframes which are mounted alongside the two edges and an end of one of the d-c leadframes. Further switching die are soldered to the 3a-c leadframes and wire bonded to the other d-c leadframe. The die are spaced along and follow a general U-shaped path. The leadframes are mounted on a heat sink which receives an insulation spacer and cap to form a hermetically sealed volume around the leadframes and die. The heat sink has cavities to mount bus capacitors and has a water cooling channel which follows and is below the U-shaped path of the die.

Abstract: A fluid-cooled heatsink and backplate, for example, for an electronic power module in an automotive application are provided, the backplate formed with a set of grooves, and the heatsink formed with a set of ribs corresponding to the set of grooves and extending into and affixed to the set of grooves. Glue or adhesive material, such as silicone or silicone o-rings, may be provided between the set of ribs and the set of grooves to secure the backplate to the heatsink. A second set of ribs extending from the heatsink may also be included, such that space is allowed between each rib of the second set of ribs and the backplate. An epoxy-adhesive material may be disposed between the second set of ribs and the backplate, or the second set of ribs may be welded or partially welded. Also provided are the backplate and a method of manufacture.

Abstract: A rectifier device for a three-phase dynamo of motor vehicles has a cooling body, with at least one circuit carrier arranged on the cooling body and having a surface with an electrically conductive structure, having at least a first diode which is arranged on the electrically conductive structure of the surface of a circuit carrier and which is designed to rectify a first half wave, and having at least a second diode arranged on the cooling body and designed to rectify a second half wave.

Abstract: A rectifier device with at least one cooling body), with at least one diode arranged on the cooling body, with at least one protective layer is arranged on the diode and the cooling body, and with at least one receptacle at the cooling body for connection to the protective layer.