Patents by Inventor Voon Joon Liew

Voon Joon Liew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin plastic leadless package with exposed metal die paddle
    Patent number: 9691688
    Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: June 27, 2017
    Assignee: CARSEM (M) SDN. BHD.
    Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
  • THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE
    Publication number: 20160049357
    Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.
    Type: Application
    Filed: October 26, 2015
    Publication date: February 18, 2016
    Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
  • Thin plastic leadless package with exposed metal die paddle
    Patent number: 9190385
    Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: November 17, 2015
    Assignee: Carsem (M) SDN. BHD.
    Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
  • Multiple row exposed leads for MLP high density packages
    Patent number: 7846774
    Abstract: A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: December 7, 2010
    Assignee: Carsem (M) SDN. BHD.
    Inventors: Mow Lum Yee, Chee Heng Wong, Shang Yan Choong, Kam Chuan Lau, Kok Siang Goh, Voon Joon Liew, Chee Sang Yip, Say Yeow Lee
  • Thin Plastic Leadless Package with Exposed Metal Die Paddle
    Publication number: 20090026594
    Abstract: A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps.
    Type: Application
    Filed: October 30, 2007
    Publication date: January 29, 2009
    Applicant: Carsem (M) Sdn.Bhd.
    Inventors: Mow Lum Yee, Kam Chuan Lau, Kok Siang Goh, Shang Yan Choong, Voon Joon Liew, Chee Sang Yip
  • MULTIPLE ROW EXPOSED LEADS FOR MLP HIGH DENSITY PACKAGES
    Publication number: 20070281392
    Abstract: A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.
    Type: Application
    Filed: August 18, 2006
    Publication date: December 6, 2007
    Applicant: CARSEM (M) SDN. BHD.
    Inventors: Mow Lum Yee, Chee Heng Wong, Shang Yan Choong, Kam Chuan Lau, Kok Siang Goh, Voon Joon Liew, Chee Sang Yip, Say Yeow Lee