Patents by Inventor Voon Siong Chin

Voon Siong Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
    Patent number: 8283761
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: October 9, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES
    Publication number: 20110254144
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Application
    Filed: June 28, 2011
    Publication date: October 20, 2011
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
    Patent number: 7968376
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: June 28, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES
    Publication number: 20100029043
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Application
    Filed: September 22, 2009
    Publication date: February 4, 2010
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • Packaged microelectronic devices with a lead frame
    Patent number: 7612436
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: November 3, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai-Chie Wang