Patents by Inventor Vova R. Markovich

Vova R. Markovich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making circuitized substrate with a resistor
    Patent number: 7870664
    Abstract: A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: January 18, 2011
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Vova R. Markovich
  • Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
    Publication number: 20080151515
    Abstract: A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.
    Type: Application
    Filed: May 2, 2007
    Publication date: June 26, 2008
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Rabindra N. Das, John M. Lauffer, Vova R. Markovich