Abstract: Various techniques are provided for protecting an infrared imager of a wafer level package. In one example, a method includes maintaining a protective member in a first position blocking an aperture of a wafer level package of an imaging system to protect an infrared imager disposed within the wafer level package. The method also includes attaching an optical assembly to the imaging system. The method also includes translating the protective member from the first position to a second position in response to a first force applied by the optical assembly against the imaging system during the attaching. The protective member is displaced from the aperture in the second position to expose the aperture to the optical assembly. Additional methods and systems are also provided.

Abstract: Various techniques are provided for using one or more thermal infrared (IR) imaging modules to enhance the dynamic range of images. In one example, devices and methods provide a first IR imaging module that captures a first image, a second IR imaging module optimized for higher IR irradiance that captures a second image, and a processing system that detects saturated pixels of the first image, determines pixels of the second image corresponding to the saturated pixels of the first image, and generates a combined image based on non-saturated pixels of the first image and the pixels of the second image. The IR imaging modules may be a microbolometer focal plane array (FPA) configured for high-gain, and a microbolometer FPA configured for low-gain. The IR imaging modules may be a photon detector FPA and a microbolometer FPA.

Abstract: Techniques are provided to perform flat field correction for infrared cameras using a liquid shutter. Devices and methods provide a focal plane array (FPA) that receives infrared radiation (e.g., thermal infrared radiation) from a scene, and infrared-opaque liquid disposed in a cavity of a liquid shutter housing, and a fluid controller that directs the liquid from a reservoir area of the cavity to a field of view area of the cavity to block the FPA from the infrared radiation. Flat field correction terms may be determined and radiometric calibration may be performed. In one example, a liquid shutter uses voltages to direct liquid. In another example, a liquid shutter uses magnetic fields from electromagnets to direct liquid such as ferrofluid. In another example, a liquid shutter uses electrowetting techniques to direct liquid such as water. In a further example, a liquid shutter uses a pump.

Abstract: Various devices including a three-stage switch and an infrared (IR) imaging module and methods for performing FFC using the three-stage switch and the IR imaging module are provided. The three-stage switch may have at least a first position in which the IR imaging module is powered off, a second position in which the IR imaging module is powered on and the shutter is positioned in the FOV, and a third position in which the IR imaging module is powered on and the shutter is positioned out of the FOV, wherein the second position is intermediate in relation to the first position and the third position. A thermal image of the shutter may be captured while the switch is at or adjacent to the second position, and an FFC map of FFC terms may be acquired based on the thermal image of the shutter.

Abstract: Various techniques are provided to implement a modular infrared imager assembly configured to interface with supporting electronics provided, for example, by a third party. In one example, a system includes an imager assembly comprising a focal plane array configured to capture thermal image data from a scene and output the thermal image data, a printed circuit board assembly, and processing electronics communicatively connected to the focal plane array through the printed circuit board assembly and configured to receive and process the thermal image data. The system further includes a connector communicatively connected to the imager assembly and configured to interface with supporting electronics configured to receive and additionally process the thermal image data.

Abstract: Various embodiments of the present disclosure may include an assembly with a shock detection and disabling device. The shock detection and disabling device may detect when a shock greater than a shock threshold has been experienced by the assembly and disable the assembly. In certain embodiments, the shock detection and disabling device may include a shock detection component connected to an electrical conductor to form an electrical circuit. When a force above a threshold force level and/or profile is detected by the shock detection component, the shock detection component may break the electrical circuit to render the assembly inoperable.

Abstract: Techniques are disclosed for systems and methods to provide reliable analyte spatial detection systems. An analyte spatial detection system includes an imaging module, a visible light projector, associated processing and control electronics, and, optionally, orientation and/or position sensors integrated with the imaging module and/or the visible light projector. The imaging module includes sensor elements configured to detect electromagnetic radiation in one or more selected spectrums, such as infrared, visible light, and/or other spectrums. The visible light projector includes one or more types of projectors configured project visible light within a spatial volume monitored by the imaging module. The system may be partially or completely portable and/or fixed in place. The visible light projector is used to indicate presence of a detected analyte on a surface near or adjoining the spatial position of the detected analyte.

Abstract: Various techniques are provided for using one or more thermal infrared (IR) imaging modules to enhance the dynamic range of images. In one example, devices and methods provide a first IR imaging module that captures a first image, a second IR imaging module optimized for higher IR irradiance that captures a second image, and a processing system that detects saturated pixels of the first image, determines pixels of the second image corresponding to the saturated pixels of the first image, and generates a combined image based on non-saturated pixels of the first image and the pixels of the second image. The IR imaging modules may be a microbolometer focal plane array (FPA) configured for high-gain, and a microbolometer FPA configured for low-gain. The IR imaging modules may be a photon detector FPA and a microbolometer FPA.

Abstract: Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken.

Abstract: Techniques are provided to perform flat field correction for infrared cameras using a liquid shutter. Devices and methods provide a focal plane array (FPA) that receives infrared radiation (e.g., thermal infrared radiation) from a scene, and infrared-opaque liquid disposed in a cavity of a liquid shutter housing, and a fluid controller that directs the liquid from a reservoir area of the cavity to a field of view area of the cavity to block the FPA from the infrared radiation. Flat field correction terms may be determined and radiometric calibration may be performed. In one example, a liquid shutter uses voltages to direct liquid. In another example, a liquid shutter uses magnetic fields from electromagnets to direct liquid such as ferrofluid. In another example, a liquid shutter uses electrowetting techniques to direct liquid such as water. In a further example, a liquid shutter uses a pump.

Abstract: Techniques are disclosed for systems and methods to provide reliable analyte spatial detection systems. An analyte spatial detection system includes an imaging module, a visible light projector, associated processing and control electronics, and, optionally, orientation and/or position sensors integrated with the imaging module and/or the visible light projector. The imaging module includes sensor elements configured to detect electromagnetic radiation in one or more selected spectrums, such as infrared, visible light, and/or other spectrums. The visible light projector includes one or more types of projectors configured project visible light within a spatial volume monitored by the imaging module. The system may be partially or completely portable and/or fixed in place. The visible light projector is used to indicate presence of a detected analyte on a surface near or adjoining the spatial position of the detected analyte.

Abstract: Various techniques are provided to implement a modular infrared imager assembly configured to interface with supporting electronics provided, for example, by a third party. In one example, a system includes an imager assembly comprising a focal plane array configured to capture thermal image data from a scene and output the thermal image data, a printed circuit board assembly, and processing electronics communicatively connected to the focal plane array through the printed circuit board assembly and configured to receive and process the thermal image data. The system further includes a connector communicatively connected to the imager assembly and configured to interface with supporting electronics configured to receive and additionally process the thermal image data.

Abstract: Various embodiments of the present disclosure may include an assembly with a shock detection and disabling device. The shock detection and disabling device may detect when a shock greater than a shock threshold has been experienced by the assembly and disable the assembly. In certain embodiments, the shock detection and disabling device may include a shock detection component connected to an electrical conductor to form an electrical circuit. When a force above a threshold force level and/or profile is detected by the shock detection component, the shock detection component may break the electrical circuit to render the assembly inoperable.

Abstract: Various devices including a three-stage switch and an infrared (IR) imaging module and methods for performing FFC using the three-stage switch and the IR imaging module are provided. The three-stage switch may have at least a first position in which the IR imaging module is powered off, a second position in which the IR imaging module is powered on and the shutter is positioned in the FOV, and a third position in which the IR imaging module is powered on and the shutter is positioned out of the FOV, wherein the second position is intermediate in relation to the first position and the third position. A thermal image of the shutter may be captured while the switch is at or adjacent to the second position, and an FFC map of FFC terms may be acquired based on the thermal image of the shutter.

Abstract: Various techniques are provided to perform flat field correction for infrared cameras. In one example, a method of calibrating an infrared camera includes calibrating a focal plane array (FPA) of the infrared camera to an external scene to determine a set of flat field correction values associated with a first optical path from the external scene to the FPA. The method also includes estimating a temperature difference between the FPA and a component of the infrared camera that is in proximity to the first optical path. The method also includes determining supplemental flat field correction values based on, at least in part, the first set of flat field correction values, where the supplemental flat field correction values are adjusted based on the estimated temperature difference before being applied to thermal image data obtained with the infrared camera. The method also includes storing the supplemental flat field correction values.

Abstract: Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken.

Abstract: Various techniques are provided to perform flat field correction for infrared cameras. In one example, a method of calibrating an infrared camera includes calibrating a focal plane array (FPA) of the infrared camera to an external scene to determine a set of flat field correction values associated with a first optical path from the external scene to the FPA. The method also includes calibrating the FPA to a shutter of the infrared camera to determine a set of flat field correction values associated with a second optical path from the shutter to the FPA. The method also includes using the flat field correction values associated with the first and second optical paths to calculate a set of supplemental flat field correction values to apply to thermal image data obtained with the infrared camera. The method also includes storing the supplemental flat field correction values.

Abstract: One or more embodiments of the invention provide for a lens package comprising a housing having a vacuum compatible interior space, a base coupled to the housing, a lens coupled to the housing, and an infrared detector within the housing for providing infrared images representative of infrared energy received through the lens. The housing, base, and lens are adapted to form an infrared detector vacuum package assembly. The housing may include a focal alignment feature that allows for focal adjustment of the lens relative to the infrared detector by applying pressure to at least a portion of the housing.

Abstract: Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.

Abstract: Systems and methods for providing a sealed container having a reduced pressure atmosphere are disclosed. The container is suitable for housing an infrared detector array. Outgassing can be enhanced by adding features to solder preforms that maintain pathways for gasses to more readily exit the container prior to sealing thereof. Getters can be used to mitigate undesirable gases within the sealed container. One or more bolometers can be used to determine if the sealed container is leaking. A vacuum positioning fixture can be used to assemble the components of the infrared detector assembly and to place the infrared detector assemblies into a vacuum chamber. The cost of manufacturing such infrared detector assemblies may be reduced and the reliability thereof enhanced.