Patents by Inventor Vu Q. Bui

Vu Q. Bui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
    Patent number: 4810326
    Abstract: A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon.
    Type: Grant
    Filed: August 31, 1987
    Date of Patent: March 7, 1989
    Assignee: International Business Machines Corporation
    Inventors: Suryadevara V. Babu, Vu Q. Bui, Joseph G. Hoffarth, John A. Welsh
  • Plasma etch enhancement with large mass inert gas
    Patent number: 4797178
    Abstract: The present invention provides a process for plasma cleaning and an improved gas mixture for use in a plasma cleaning process. The gas mixture of the present invention includes the normal process gases such as oxygen and carbon tetrafluoride. However, the mixture also includes a small percentage of a large mass inert gas such as Argon or Krypton. This large mass gas molecule mechanically removes any polymerized fluorocarbon that forms on the surface being cleaned thereby significantly enhancing the rate of etch or cleaning.It has been found that five to twenty percent of the inert gas is the preferred range and that ten percent produces optimum results.
    Type: Grant
    Filed: May 13, 1987
    Date of Patent: January 10, 1989
    Assignee: International Business Machines Corporation
    Inventors: Vu Q. Bui, Kevin K. Chan, Joseph G. Hoffarth, Vicki J. Malueg