Patents by Inventor Vu Thanh

Vu Thanh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230420073
    Abstract: A system for determining pathogenic genetic variants is described.
    Type: Application
    Filed: June 26, 2022
    Publication date: December 28, 2023
    Applicant: Gene Friend Way, Inc.
    Inventors: Duyen Thanh Bui, Tuan Anh Cao, Giang Vu Thanh Pham
  • Publication number: 20230224247
    Abstract: Techniques are described for providing a scaled-out transport supported by interconnected data processing units (DPUs) that operates as a single system bus connection proxy for device-to-device communications within a data center. As one example, this disclosure describes techniques for providing a Peripheral Component Interconnect Express (PCIe) proxy for device-to-device communications employing the PCIe standard. The disclosed techniques include adding PCIe proxy logic on top of a host unit of a DPU to expose a PCIe proxy model to application processors, storage devices, network interface controllers, field programmable gate arrays, or other PCIe endpoint devices. The PCIe proxy model may be implemented as a physically distributed Ethernet-based switch fabric with PCIe proxy logic at the edge and fronting the PCIe endpoint devices. The interconnected DPUs and the distributed Ethernet-based switch fabric together provide a reliable, low-latency, and scaled-out transport that operates as a PCIe proxy.
    Type: Application
    Filed: March 23, 2023
    Publication date: July 13, 2023
    Inventors: Wael Noureddine, Felix A. Marti, Aibing Zhou, Dmitriy Leonidovich Budko, Gaurav Gupte, Hoai Vu Thanh Tran, Aravind Vidhyasagar Lappasi, Leith Alan Leedom, Rajesh G. Nair
  • Patent number: 11637773
    Abstract: Techniques are described for providing a scaled-out transport supported by interconnected data processing units (DPUs) that operates as a single system bus connection proxy for device-to-device communications within a data center. As one example, this disclosure describes techniques for providing a Peripheral Component Interconnect Express (PCIe) proxy for device-to-device communications employing the PCIe standard. The disclosed techniques include adding PCIe proxy logic on top of a host unit of a DPU to expose a PCIe proxy model to application processors, storage devices, network interface controllers, field programmable gate arrays, or other PCIe endpoint devices. The PCIe proxy model may be implemented as a physically distributed Ethernet-based switch fabric with PCIe proxy logic at the edge and fronting the PCIe endpoint devices. The interconnected DPUs and the distributed Ethernet-based switch fabric together provide a reliable, low-latency, and scaled-out transport that operates as a PCIe proxy.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: April 25, 2023
    Assignee: FUNGIBLE, INC.
    Inventors: Wael Noureddine, Felix A. Marti, Aibing Zhou, Dmitriy Leonidovich Budko, Gaurav Gupte, Hoai Vu Thanh Tran, Aravind Vidhyasagar Lappasi, Leith Alan Leedom, Rajesh G. Nair
  • Patent number: 11096660
    Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: August 24, 2021
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Elisa E. Konofagou, Jean Provost, Jianwen Luo, Stanley J. Okrasinski, Stéphane Thiébaut, Vu Thanh-Hieu Nguyen
  • Publication number: 20210250285
    Abstract: Techniques are described for providing a scaled-out transport supported by interconnected data processing units (DPUs) that operates as a single system bus connection proxy for device-to-device communications within a data center. As one example, this disclosure describes techniques for providing a Peripheral Component Interconnect Express (PCIe) proxy for device-to-device communications employing the PCIe standard. The disclosed techniques include adding PCIe proxy logic on top of a host unit of a DPU to expose a PCIe proxy model to application processors, storage devices, network interface controllers, field programmable gate arrays, or other PCIe endpoint devices. The PCIe proxy model may be implemented as a physically distributed Ethernet-based switch fabric with PCIe proxy logic at the edge and fronting the PCIe endpoint devices. The interconnected DPUs and the distributed Ethernet-based switch fabric together provide a reliable, low-latency, and scaled-out transport that operates as a PCIe proxy.
    Type: Application
    Filed: February 9, 2021
    Publication date: August 12, 2021
    Inventors: Wael Noureddine, Felix A. Marti, Aibing Zhou, Dmitriy Leonidovich Budko, Gaurav Gupte, Hoai Vu Thanh Tran, Aravind Vidhyasagar Lappasi, Leith Alan Leedom, Rajesh G. Nair
  • Patent number: 10455738
    Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: October 22, 2019
    Assignee: Apple Inc.
    Inventors: David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, Vu Thanh Vo, Amir Salehi, Dennis R. Pyper, Alex J. Crumlin, Corey S. Provencher, Derek J. Walters, Michael V. Yeh
  • Publication number: 20180084636
    Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 22, 2018
    Inventors: David A. PAKULA, Daniel W. JARVIS, Gregory N. STEPHENS, Ian A. SPRAGGS, Vu Thanh VO, Amir SALEHI, Dennis R. PYPER, Alex J. CRUMLIN, Corey S. PROVENCHER, Derek J. WALTERS, Michael V. YEH
  • Publication number: 20160296203
    Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.
    Type: Application
    Filed: April 8, 2016
    Publication date: October 13, 2016
    Applicant: The Trustees of Columbia University in the City of New York
    Inventors: Elisa E. KONOFAGOU, Jean PROVOST, Jianwen LUO, Stanley J. OKRASINSKI, Stéphane THIÉBAUT, Vu Thanh-Hieu NGUYEN
  • Patent number: 9320491
    Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: April 26, 2016
    Assignee: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
    Inventors: Elisa E. Konofagou, Jean Provost, Jianwen Luo, Stanley J. Okrasinski, III, Stéphane Thiébaut, Vu Thanh-Hieu Nguyen
  • Publication number: 20140135625
    Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.
    Type: Application
    Filed: October 18, 2013
    Publication date: May 15, 2014
    Applicant: The Trustees of Columbia University in the City of New York
    Inventors: Elisa E. KONOFAGOU, Clark T. HUNG, Jean PROVOST, Jianwen LUO, Stanley J. OKRASINSKI, III, Stéphane THIÉBAUT, Vu Thanh-Hieu NGUYEN
  • Publication number: 20140055969
    Abstract: Board assemblies with minimized warpage and systems and methods for making the same are disclosed. A board may be pre-conditioned by designing the board to mount components in selected areas of the board and by selectively copper flooding certain regions of the board. Pre-conditioning of the board may assist in preventing board warpage. A reflow fixture may fix a board during solder pasting and reflow processing thereof. After reflow, an underfill fixture may fix the board during underfill processing. Each of these fixtures may include respective clamp members that may hold various portions of the board to correct and/or prevent warpage of the board.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 27, 2014
    Applicant: APPLE INC.
    Inventors: Vu Thanh Vo, Dennis Pyper
  • Patent number: 6601180
    Abstract: A method and system for providing link detection to a PC Card for power management. Specifically, one embodiment of the present invention includes a method for reducing power consumption by a peripheral component coupled to a host computer. For instance, the method includes the step of detecting whether a peripheral component is coupled to an active communication link. The method also includes the step of determining whether a circuit of the peripheral component is within a first power consuming mode (e.g., high power consuming mode). Provided the peripheral component is not coupled to the active communication link and the circuit of the peripheral component is within the first power consuming mode, the method includes the step of causing the circuit to enter a second power consuming mode (e.g., a sleep mode).
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: July 29, 2003
    Assignee: 3Com Corporation
    Inventors: Vladimir Paredes, Lomberto Jimenez, Vu Thanh