Patents by Inventor Vu Thanh
Vu Thanh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230420073Abstract: A system for determining pathogenic genetic variants is described.Type: ApplicationFiled: June 26, 2022Publication date: December 28, 2023Applicant: Gene Friend Way, Inc.Inventors: Duyen Thanh Bui, Tuan Anh Cao, Giang Vu Thanh Pham
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Publication number: 20230224247Abstract: Techniques are described for providing a scaled-out transport supported by interconnected data processing units (DPUs) that operates as a single system bus connection proxy for device-to-device communications within a data center. As one example, this disclosure describes techniques for providing a Peripheral Component Interconnect Express (PCIe) proxy for device-to-device communications employing the PCIe standard. The disclosed techniques include adding PCIe proxy logic on top of a host unit of a DPU to expose a PCIe proxy model to application processors, storage devices, network interface controllers, field programmable gate arrays, or other PCIe endpoint devices. The PCIe proxy model may be implemented as a physically distributed Ethernet-based switch fabric with PCIe proxy logic at the edge and fronting the PCIe endpoint devices. The interconnected DPUs and the distributed Ethernet-based switch fabric together provide a reliable, low-latency, and scaled-out transport that operates as a PCIe proxy.Type: ApplicationFiled: March 23, 2023Publication date: July 13, 2023Inventors: Wael Noureddine, Felix A. Marti, Aibing Zhou, Dmitriy Leonidovich Budko, Gaurav Gupte, Hoai Vu Thanh Tran, Aravind Vidhyasagar Lappasi, Leith Alan Leedom, Rajesh G. Nair
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Patent number: 11637773Abstract: Techniques are described for providing a scaled-out transport supported by interconnected data processing units (DPUs) that operates as a single system bus connection proxy for device-to-device communications within a data center. As one example, this disclosure describes techniques for providing a Peripheral Component Interconnect Express (PCIe) proxy for device-to-device communications employing the PCIe standard. The disclosed techniques include adding PCIe proxy logic on top of a host unit of a DPU to expose a PCIe proxy model to application processors, storage devices, network interface controllers, field programmable gate arrays, or other PCIe endpoint devices. The PCIe proxy model may be implemented as a physically distributed Ethernet-based switch fabric with PCIe proxy logic at the edge and fronting the PCIe endpoint devices. The interconnected DPUs and the distributed Ethernet-based switch fabric together provide a reliable, low-latency, and scaled-out transport that operates as a PCIe proxy.Type: GrantFiled: February 9, 2021Date of Patent: April 25, 2023Assignee: FUNGIBLE, INC.Inventors: Wael Noureddine, Felix A. Marti, Aibing Zhou, Dmitriy Leonidovich Budko, Gaurav Gupte, Hoai Vu Thanh Tran, Aravind Vidhyasagar Lappasi, Leith Alan Leedom, Rajesh G. Nair
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Patent number: 11096660Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.Type: GrantFiled: April 8, 2016Date of Patent: August 24, 2021Assignee: The Trustees of Columbia University in the City of New YorkInventors: Elisa E. Konofagou, Jean Provost, Jianwen Luo, Stanley J. Okrasinski, Stéphane Thiébaut, Vu Thanh-Hieu Nguyen
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Publication number: 20210250285Abstract: Techniques are described for providing a scaled-out transport supported by interconnected data processing units (DPUs) that operates as a single system bus connection proxy for device-to-device communications within a data center. As one example, this disclosure describes techniques for providing a Peripheral Component Interconnect Express (PCIe) proxy for device-to-device communications employing the PCIe standard. The disclosed techniques include adding PCIe proxy logic on top of a host unit of a DPU to expose a PCIe proxy model to application processors, storage devices, network interface controllers, field programmable gate arrays, or other PCIe endpoint devices. The PCIe proxy model may be implemented as a physically distributed Ethernet-based switch fabric with PCIe proxy logic at the edge and fronting the PCIe endpoint devices. The interconnected DPUs and the distributed Ethernet-based switch fabric together provide a reliable, low-latency, and scaled-out transport that operates as a PCIe proxy.Type: ApplicationFiled: February 9, 2021Publication date: August 12, 2021Inventors: Wael Noureddine, Felix A. Marti, Aibing Zhou, Dmitriy Leonidovich Budko, Gaurav Gupte, Hoai Vu Thanh Tran, Aravind Vidhyasagar Lappasi, Leith Alan Leedom, Rajesh G. Nair
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Patent number: 10455738Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.Type: GrantFiled: September 21, 2017Date of Patent: October 22, 2019Assignee: Apple Inc.Inventors: David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, Vu Thanh Vo, Amir Salehi, Dennis R. Pyper, Alex J. Crumlin, Corey S. Provencher, Derek J. Walters, Michael V. Yeh
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Publication number: 20180084636Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.Type: ApplicationFiled: September 21, 2017Publication date: March 22, 2018Inventors: David A. PAKULA, Daniel W. JARVIS, Gregory N. STEPHENS, Ian A. SPRAGGS, Vu Thanh VO, Amir SALEHI, Dennis R. PYPER, Alex J. CRUMLIN, Corey S. PROVENCHER, Derek J. WALTERS, Michael V. YEH
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Publication number: 20160296203Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.Type: ApplicationFiled: April 8, 2016Publication date: October 13, 2016Applicant: The Trustees of Columbia University in the City of New YorkInventors: Elisa E. KONOFAGOU, Jean PROVOST, Jianwen LUO, Stanley J. OKRASINSKI, Stéphane THIÉBAUT, Vu Thanh-Hieu NGUYEN
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Patent number: 9320491Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.Type: GrantFiled: October 18, 2013Date of Patent: April 26, 2016Assignee: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORKInventors: Elisa E. Konofagou, Jean Provost, Jianwen Luo, Stanley J. Okrasinski, III, Stéphane Thiébaut, Vu Thanh-Hieu Nguyen
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Publication number: 20140135625Abstract: Ultrasound methods, devices, and systems are described which support a useful compromise in terms of spatial resolution and temporal resolution for capturing motion in tissue structures. Tissue engineering articles, methods, systems, and devices which employ ultrasound to deliver biological agents to selected regions of a tissue scaffold, deliver mechanical stimulation to cells growing in a tissue scaffold, and enhance the perfusion of fluids through tissue scaffolds.Type: ApplicationFiled: October 18, 2013Publication date: May 15, 2014Applicant: The Trustees of Columbia University in the City of New YorkInventors: Elisa E. KONOFAGOU, Clark T. HUNG, Jean PROVOST, Jianwen LUO, Stanley J. OKRASINSKI, III, Stéphane THIÉBAUT, Vu Thanh-Hieu NGUYEN
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Publication number: 20140055969Abstract: Board assemblies with minimized warpage and systems and methods for making the same are disclosed. A board may be pre-conditioned by designing the board to mount components in selected areas of the board and by selectively copper flooding certain regions of the board. Pre-conditioning of the board may assist in preventing board warpage. A reflow fixture may fix a board during solder pasting and reflow processing thereof. After reflow, an underfill fixture may fix the board during underfill processing. Each of these fixtures may include respective clamp members that may hold various portions of the board to correct and/or prevent warpage of the board.Type: ApplicationFiled: August 21, 2012Publication date: February 27, 2014Applicant: APPLE INC.Inventors: Vu Thanh Vo, Dennis Pyper
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Patent number: 6601180Abstract: A method and system for providing link detection to a PC Card for power management. Specifically, one embodiment of the present invention includes a method for reducing power consumption by a peripheral component coupled to a host computer. For instance, the method includes the step of detecting whether a peripheral component is coupled to an active communication link. The method also includes the step of determining whether a circuit of the peripheral component is within a first power consuming mode (e.g., high power consuming mode). Provided the peripheral component is not coupled to the active communication link and the circuit of the peripheral component is within the first power consuming mode, the method includes the step of causing the circuit to enter a second power consuming mode (e.g., a sleep mode).Type: GrantFiled: April 14, 2000Date of Patent: July 29, 2003Assignee: 3Com CorporationInventors: Vladimir Paredes, Lomberto Jimenez, Vu Thanh