Patents by Inventor Vu V. Lam

Vu V. Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
    Patent number: 6218446
    Abstract: A radiation-curable formulation employs an electrically conductive primary filler, comprised of elements of elongate form and having surfaces that reflect the actinic radiation to which the photoinitiator employed is responsive, and a secondary filler that is electrically semiconducting and is substantially transparent to the actinic radiation; silver-coated cylindrical fibers or rods will typically constitute the primary conductive filler. Solid deposits cured from the formulation may function, for example, as sealing elements, gaskets, solder joints, and coatings.
    Type: Grant
    Filed: July 26, 1999
    Date of Patent: April 17, 2001
    Assignee: Dymax Corporation
    Inventors: John R. Arnold, Vu V. Lam, Andrew G. Bachmann