Abstract: A method for packaging an integrated circuit comprises the steps of: providing a ground plane, the ground plane having a recessed area shaped to receive an integrated circuit die, wherein the integrated circuit die having a first surface with active circuitry, a second surface, and an edge generally orthogonal to the first and second surfaces; attaching the second surface of the integrated circuit die to a bottom of the recessed area with a thermally conductive adhesive; filling a space between the edge of the integrated circuit die and a side of the recessed area with a fill material; forming an insulating layer on the ground plane and the first surface of the integrated circuit die; patterning the insulating layer to expose contacts on the first surface of the integrated circuit die; and plating electrical conductors on the insulating layer and the contacts.