Patents by Inventor W.C. CHEN

W.C. CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS FOR MEASURING A MAGNETIC CORE LAYER PROFILE IN AN INTEGRATED CIRCUIT
    Publication number: 20230026359
    Abstract: An inductive structure may be manufactured with in-situ characterization of dimensions by forming a metal line on a top surface of a semiconductor die, forming a passivation dielectric layer over the metal line, measuring a height profile of a top surface of the passivation dielectric layer as a function of a lateral displacement, forming a magnetic material plate over the passivation dielectric layer, measuring a height profile of a top surface of the magnetic material plate as a function of the lateral displacement, and determining a thickness profile of the magnetic material plate by subtracting the height profile of the top surface of the passivation dielectric layer from the height profile of the top surface of the magnetic material plate. An inductive structure including the magnetic material plate and the metal line is formed.
    Type: Application
    Filed: March 29, 2022
    Publication date: January 26, 2023
    Inventors: W.C. CHEN, T.C. LIN