Abstract: Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Abstract: A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a tertiary cyclohexanediols of Formulae V and VI are disclosed, which are useful in the forming of microelectronic assemblies: a representative example of a dicarboxylic acid is an oxalic acid and representative example of thermally decomposable polyester is the polyester of the formula: wherein m is at least about 100.

Abstract: A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a difunctional tertiary alcohol are disclosed, which are useful in the forming of microelectronic assemblies. A representative example of a composition comprises a thermally decomposable polyester of the formula: wherein m is at least about 100.

Abstract: Embodiments in accordance with the present invention relate generally to polycarbonate polymers having repeat units derived from polycyclic-epoxide monomers and methods of using such polymers and compositions containing them, and more specifically to polymers and compositions of polycarbonates that encompass repeat units derived from norbornane and tetracyclododecane, and methods of using such compositions.

Abstract: A thermally decomposable polymer composition comprising a polyester containing repeating units of an ester of diglycolic acid and difunctional tertiary alcohol are disclosed, which are useful in the forming of microelectronic assemblies. A representative example of a composition comprises a thermally decomposable polymer of the formula: wherein n is at least about 20, which provides both tackiness and solder fluxing, among other benefits.

Abstract: Embodiments in accordance with the present invention relate generally to polycarbonate polymers having repeat units derived from polycyclic-epoxide monomers and methods of using such polymers and compositions containing them, and more specifically to polymers and compositions of polycarbonates that encompass repeat units derived from norbornane and tetracyclododecane, and methods of using such compositions.

Abstract: Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

Abstract: Embodiments in accordance with the present invention relate generally to polymer compositions useful in the forming of microelectronic assemblies, and more specifically to such compositions that encompass a thermally decomposable polymer and that provide both tackiness and solder fluxing.

Abstract: Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.

Abstract: Embodiments according to the present invention relate to sacrificial polymer compositions that include polycarbonate polymers having repeat units derived from stereospecific polycyclic 2,3-diol monomers. The sacrificial polymer compositions also include an acid generator that is selected from at least one photoacid generator and/or at least one thermal acid generator. In addition, embodiments according to the present invention relate to a method of forming a structure that includes a three-dimensional space interposed between a substrate and an overcoat layer, and a method of temporarily bonding first and second substrates together, which make use of the polycarbonate polymers.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.

Abstract: Embodiments according to the present invention relate to sacrificial polymer compositions that include polycarbonate polymers having repeat units derived from stereospecific polycyclic 2,3-diol monomers. The sacrificial polymer compositions also include an acid generator that is selected from at least one photoacid generator and/or at least one thermal acid generator. In addition, embodiments according to the present invention relate to a method of forming a structure that includes a three-dimensional space interposed between a substrate and an overcoat layer, and a method of temporarily bonding first and second substrates together, which make use of the polycarbonate polymers.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Abstract: Embodiments according to the present invention relate to sacrificial polymer compositions that include polycarbonate polymers having repeat units derived from stereospecific polycyclic 2,3-diol monomers. The sacrificial polymer compositions also include an acid generator that is selected from at least one photoacid generator and/or at least one thermal acid generator. In addition, embodiments according to the present invention relate to a method of forming a structure that includes a three-dimensional space interposed between a substrate and an overcoat layer, and a method of temporarily bonding first and second substrates together, which make use of the polycarbonate polymers.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Abstract: Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.