Patents by Inventor W. E. Armstrong

W. E. Armstrong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertically interconnected integrated circuit chip system
    Patent number: 4991000
    Abstract: A high density IC layout is achieved by providing conductive feedthroughs through an IC chip directly to input/output locations within the circuitry, inward from the periphery of the chip or alternately at the periphery of the chip. The chip can thus be mounted to a substrate face up, allowing for visual inspection and simplified mounting techniques. To provide a high density 3-D stack, substrates with chips mounted thereon are stacked together, with substrate feedthroughs connecting to selected chip feedthrough via the substrate routing, and successive layers electrically connected by contact springs. Chips mounted on a single substrate can also be used in a 2-D configuration, without substrate feedthroughs.
    Type: Grant
    Filed: August 31, 1989
    Date of Patent: February 5, 1991
    Inventors: Robert L. Bone, W. E. Armstrong