Patents by Inventor W.H. Lin

W.H. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal Shielding on Die Level
    Publication number: 20140264784
    Abstract: Consistent with an example embodiment, there is a semiconductor device having a front-side surface, back-side surface, and vertical surfaces. The semiconductor device comprises an active device die having electrical contacts on the front-side surface. A metal shield is plated on the back-side surface and the vertical surfaces of the active device die. Conductive links connect the plated metal shield to selected electrical contacts on the front-side surface.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Chung Hsiung Ho, Wen Hung Huang, Wen-Jen Kuo, W.H. Lin, ChihLi Huang, Pao Tung Pan, I. Pin Chen, Li Ching Wang