Abstract: A cooling and a power distribution system for integrated circuits is presented comprising a thermally conducting, preferably metal plate having power distributing buss bars embedded therein. The plate further has thermally conductive and electrically conductive elastomeric material selectively attached thereto. The electrically conductive material being directly connected to the buss bars. The cooling and power distribution plate will then attach via its top and/or bottom surfaces to a printed wiring board having integrated circuits and other electronic components thereon. The thermally conductive elastomers conform over, and to some extent, around the tops of the IC's so as to dissipate heat generated by the IC's during operation. Similarly, the electrically conductive elastomers will provide power and/or ground connection to predetermined points on the printed wiring board and IC's. Preferably, a liquid coolant is circulated through coring provided in the thermally conductive plate.