Patents by Inventor W. L. Whieh

W. L. Whieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure of a ball grid array substrate with charts for indicating position of defective chips
    Patent number: 6274883
    Abstract: A ball grid array substrate includes a circumferential edge provided with a plurality of charts each having a plurality of lattices corresponding to positions of chips on the ball grid array substrate for indicating positions of defective chips in different packaging procedures whereby positions of the defective chips can be easily observed.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: August 14, 2001
    Assignee: Orient Semiconductor Electronics Ltd.
    Inventor: W. L. Whieh
  • Heat dissipation module
    Patent number: 6260611
    Abstract: A high watt number heat dissipation module having externally exposed fins is disclosed. The high heat produced by semiconductor operation is dissipated employing the present module, and the packaging rubber body is prevented from overflow. The present module is mounted above the semiconductor wafer and the interior of the heat dissipation plate absorbs the high heat from the wafer, and heat energy is dissipated by means of the fins at the top portion of the heat dissipation plate. A plurality layers of skirts are provided at the surrounding of the heat dissipation plate and the number of layers o the skirts is dependent on the watt number of the wafer.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: July 17, 2001
    Assignee: Orient Semiconductor Electronics Ltd.
    Inventor: W. L. Whieh