Abstract: An infrared detector array and its associated conductors on a substrate are overed with an insulating antireflection layer. In one embodiment, a thin metal layer is sputtered or evaporated on this layer and the metal is masked and etched to uncover desired portions of the insulating layer over the detectors and the conductors. The mask is removed and a thick metal layer is electroplated onto the thin metal layer. An alternate embodiment applies the thick metal layer on an unetched thin metal layer, and both layers are etched through a mask to uncover the desired portions of the insulating layer. The mask is stripped and the final steps (both embodiments) include masking and etching to remove the non-metallized insulating layer on the conductors.