Abstract: A method for imaging a semiconductor wafer includes the steps of preparing a mask that is formed with at least first and second mask patterns, positioning the mask on an exposure system, positioning the wafer on the exposure system, forming a first image, which corresponds to the first mask pattern, on the wafer, removing the wafer from the exposure system, subjecting the wafer to subsequent integrated circuit forming steps, repositioning the wafer on the exposure system, and forming a second image, which corresponds to the second mask pattern, on the wafer.

Abstract: A facility for improving environmental atmosphere of interior space, which comprises: a negative ion discharger; a plurality of electric poles connect to the output wires of the negative ion discharger; the aforementioned negative ion discharger is placed in a corner of interior space, and the plurality of electric poles are situated in the upper part of the interior space. By means of the active carbon layer beneath the floor indoors, an invisible shelter will be form by the negative ions released from the negative ion discharger; accordingly, the energy of ion will be effectively decreased, and the particle condition of indoor space will be harmonized.