Abstract: Unwanted RF emissions from an imperfect enclosure surrounding an electronic apparatus are reduced by first investigating the RF field strengths inside the enclosure while the apparatus is in operation, and identifying locations where the field strengths are significantly higher than elsewhere. The field strengths at these identified locations are then lowered significantly by placing lossy materials thereat to absorb and thus dissipate RF energy. If the lossy materials are placed in the near field of the actual circuitry that generates the RF then some of that RF is dissipated according to the degree of loading, but without associated reflected energy, and without the need for the lossy material to be a free field absorber that matches the characteristic impedance of the interior of the enclosure. A hybrid arrangement also exists where the lossy material is neither a free field absorber nor located in the near field of the generator, so long as it is located in the near field of a reflector.