Patents by Inventor W.R. Bottoms

W.R. Bottoms has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120212248
    Abstract: Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability.
    Type: Application
    Filed: December 4, 2007
    Publication date: August 23, 2012
    Inventors: Fu Chiung Chong, W.R. Bottoms, Erh-Kong Chieh, Anna Litza, Douglas L. McKay, Roman L. Milter, Sha Li
  • Publication number: 20100026331
    Abstract: Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability.
    Type: Application
    Filed: December 4, 2007
    Publication date: February 4, 2010
    Inventors: Fu Chiung Chong, W.R. Bottoms, Erh-Kong Chieh, Anna Litza, Douglas L. McKay, Roman L. Milter, Sha Li