Patents by Inventor W. Scott Bonneville

W. Scott Bonneville has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020102384
    Abstract: An embedded heat pipe sandwich panel having components made using dissimilar materials is described. An exemplary embedded heat pipe sandwich panel comprises graphite faceskins secured to aluminum honeycomb core using traditional film adhesives. One or more aluminum heat pipes are embedded in the sandwich panel and thermally coupled to the faceskins using a high thermal conductivity gasket material disposed between the panel faceskins and the heat pipes.
    Type: Application
    Filed: January 29, 2001
    Publication date: August 1, 2002
    Inventors: Scott O. Peck, W. Scott Bonneville, John Cooney
  • Patent number: 6367509
    Abstract: An improved thermal harness or thermal heat strap that comprises carbon based (graphite) fiber heat conducting elements coupled to graphite, composite, polymer, or metal end attachment brackets. An outer casing comprising a tubular braided sleeve surrounds the heat conducting elements and eliminates possible contamination caused by the graphite fibers. The thermal harness may be advantageously used in electronic applications to dissipate heat from high temperature components.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: April 9, 2002
    Assignee: Space Systems/Loral, Inc.
    Inventors: W. Scott Bonneville, Roger A. Stonier
  • Patent number: 6311769
    Abstract: Thermal interface materials for use in space applications. The thermal interface materials comprise a plurality of graphitized thermally conductive (carbon based) fibers 6 that are contained, immersed, or embedded, in one or more substantially non-outgassing polymer matrix materials. Both relatively stiff and relatively stiff and compliant polymer matrix materials may be used to secure the thermally conductive fibers. The thermally conductive fibers and non-outgassing polymer matrix material may be additionally cured to improve their conductive properties. The polymer matrix materials contain volatile condensable material of less than 0.1 percent and exhibit a total mass loss of less than 1.0 percent per an ASTM E595 procedure.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: November 6, 2001
    Assignee: Space Systems/Loral, Inc.
    Inventors: W. Scott Bonneville, John E. Cooney, Scott O. Peck
  • Patent number: 6286591
    Abstract: A thermal harness comprising one or more tows of braided or bundled thermally conductive fiber extending from each of a plurality of heat generating devices to one or more heat dissipating devices. The harness may include an encapsulating membrane to contain the multiple tows. At each end or node of the tows, they are fanned out and splayed onto a patch of nonoutgassing polymer matrix material. A second piece of nonoutgassing polymer matrix material may be used to encapsulate the splayed tows at each node. The nonoutgassing polymer matrix material comprises high conductivity, small diameter fibers thermally coupled to the splayed tows of fiber and to the heat generating and heat dissipating devices. The node may be attached to the heat generating and dissipating devices using an adhesive or pyrolytic graphite flakes disposed between the polymer matrix material and the heat generating and dissipating devices.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: September 11, 2001
    Assignee: Space Systems/Loral, Inc.
    Inventor: W. Scott Bonneville