Patents by Inventor Wa-su Sin

Wa-su Sin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method thereof and a solder ball land and method thereof
    Publication number: 20070040282
    Abstract: A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance.
    Type: Application
    Filed: July 14, 2006
    Publication date: February 22, 2007
    Inventors: Ky-hyun Jung, Heui-seog Kim, Sang-jun Kim, Wa-su Sin, Ho-geon Song, Jun-young Ko