Patents by Inventor Wade A. Schwanda

Wade A. Schwanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board automated layup system
    Patent number: 11653484
    Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: May 16, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Wade A. Schwanda
  • PRINTED CIRCUIT BOARD AUTOMATED LAYUP SYSTEM
    Publication number: 20210144892
    Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.
    Type: Application
    Filed: November 8, 2019
    Publication date: May 13, 2021
    Inventors: Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Wade A. Schwanda