Patents by Inventor Wade CAMPNEY

Wade CAMPNEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10551165
    Abstract: This present disclosure generally relates to devices, methods, and systems for producing large numbers of SiO2 coated silicon chips with uniform film thickness controlled to angstrom and sub angstrom levels. The disclosure further relates to etching plates configured for receiving a plurality of chips mounted thereon.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: February 4, 2020
    Assignee: ADARZA BIOSYSTEMS, INC.
    Inventors: Christopher C. Striemer, Jared A. Carter, Wade Campney
  • Publication number: 20180143005
    Abstract: This present disclosure generally relates to devices, methods, and systems for producing large numbers of SiO2 coated silicon chips with uniform film thickness controlled to angstrom and sub angstrom levels. The disclosure further relates to etching plates configured for receiving a plurality of chips mounted thereon.
    Type: Application
    Filed: April 29, 2016
    Publication date: May 24, 2018
    Inventors: Christopher C. STRIEMER, Jared A. CARTER, Wade CAMPNEY