Abstract: An integrated circuit device including: a first die, a first die bonding pad formed on the first die, a gold bump electrode formed on the first bonding pad, and a copper wire having a first end portion stitch bonded to the gold bump electrode; and a method of forming the integrated circuit device.

Abstract: The invention provides methods and apparatus for automated contamination removal in association with integrated circuit manufacturing and testing. Disclosed embodiments include methods for cleaning electrical contacts of integrated circuit packages with steps for transporting the package from a first position to a second position and, during the transit, bringing the electrical contacts into engagement with one or more cleaning station. Aspects of the disclosed apparatus include a package transit chute for moving packages from a first position to a second position and one or more cleaning stations between the first and second positions. The cleaning stations further include one or more cleaning mats positioned for cleaning electrical contacts of packages transported in the chute.