Patents by Inventor Wade D. Vinson

Wade D. Vinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10983293
    Abstract: Hot-pluggable optical modules for high-density optical signaling are provided. The modules comprise a dual-purpose heat spreader configured to function as a thermal component and including trenches accommodating optical infrastructure. The dual-purpose heat spreader includes a trench for routing optical fibers to and from a plurality of optical connectors, each disposed on a branch of the fiber harness assembly and configured to mate with a socket on a module board through an opening in the dual-purpose heat spreader.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: April 20, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Everett R. Salinas, Wade D. Vinson
  • Publication number: 20200260617
    Abstract: In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.
    Type: Application
    Filed: February 16, 2016
    Publication date: August 13, 2020
    Inventors: Zheila N. Madanipour, William K. Norton, Wade D. Vinson
  • Publication number: 20200146182
    Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.
    Type: Application
    Filed: December 17, 2019
    Publication date: May 7, 2020
    Inventors: Tahir Cader, Wade D. Vinson, Douglas Kent Garday, John P. Franz
  • Patent number: 10638641
    Abstract: The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: April 28, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Wade D Vinson, Tahir Cader
  • Patent number: 10548242
    Abstract: A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: January 28, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Wade D Vinson, Douglas Kent Garday, John P Franz
  • Patent number: 10455726
    Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: October 22, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Tahir Cader, John P Franz, David Allen Moore, Douglas Kent Garday, Wade D Vinson
  • Publication number: 20180067524
    Abstract: In one implementation, a system for supplemental air cooling includes a heat sink mounted to a computing device, a supplemental cooling device coupled to the heat sink by a number of heat pipes, and a fan coupled to the supplemental cooling device.
    Type: Application
    Filed: April 20, 2015
    Publication date: March 8, 2018
    Inventors: David A. Moore, John p. Franz, Wade D. Vinson
  • Publication number: 20170325358
    Abstract: The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.
    Type: Application
    Filed: November 14, 2014
    Publication date: November 9, 2017
    Inventors: John FRANZ, Wade D VINSON, Tahir CADER
  • Publication number: 20170303439
    Abstract: A modular utility assembly is provided herein. The modular utility assembly includes a power module, a network module, and a cooling module. The power module includes a power connector to mate with and provide power to an electronic module. The network module includes a network connector to mate with and provide a network connection between the network module and the electronic module. The cooling module includes a cooling connector to mate with and connect to a cooling component on the electronic module.
    Type: Application
    Filed: September 30, 2014
    Publication date: October 19, 2017
    Inventors: Tahir CADER, John P FRANZ, Wade D VINSON, Arlen L ROESNER, Kevin B LEIGH, Dave MAYER
  • Publication number: 20170295667
    Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
    Type: Application
    Filed: September 30, 2014
    Publication date: October 12, 2017
    Inventors: Tahir CADER, John P FRANZ, David Allen MOORE, Douglas Kent GARDAY, Wade D Vinson
  • Publication number: 20170231118
    Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.
    Type: Application
    Filed: July 31, 2014
    Publication date: August 10, 2017
    Inventors: Tahir CADER, Wade D VINSON, Douglas Kent GARDAY, John P FRANZ
  • Patent number: 9651275
    Abstract: Examples described herein relate to adiabatic cooling units. For example, a method for mixing gases within an adiabatic cooling unit includes allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. The method includes allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. The method also includes creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: May 16, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Ernesto Ferrer, Matthew R Slaby, Wade D Vinson
  • Publication number: 20160348940
    Abstract: Examples described herein relate to adiabatic cooling units. For example, a method for mixing gases within an adiabatic cooling unit includes allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. The method includes allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. The method also includes creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.
    Type: Application
    Filed: August 10, 2016
    Publication date: December 1, 2016
    Inventors: Tahir CADER, Ernesto FERRER, Matthew R. SLABY, Wade D. VINSON
  • Patent number: 9429335
    Abstract: Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: August 30, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Ernesto Ferrer, Matthew R. Slaby, Wade D. Vinson
  • Patent number: 9057378
    Abstract: An intelligent air moving apparatus for cooling an electronics enclosure includes a motor for driving a fan at a variable rotational speed and a microcontroller for controlling the rotational speed of the motor. The microcontroller includes a speed sensor for sensing the rotational speed such that when the sensed rotational speed deviates below a target speed, the microcontroller detects a locked rotor condition.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: June 16, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John P. Franz, Wade D. Vinson, Thomas D. Rhodes, David F. Heinrich, Stephen A. Kay
  • Patent number: 8655501
    Abstract: Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: February 18, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, Robert B. Curtis, David W. Sherrod
  • Patent number: 8647077
    Abstract: A cooling fan having motor and an impeller. The cooling fan may comprise a three-phase DC motor. The impeller may comprise a hub to house the three-phase DC motor and a plurality of blades extending from the hub. Each blade may have a height that is at least 25 % of the impeller diameter.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: February 11, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wade D. Vinson, John P. Franz, Yousef Jarrah
  • Patent number: 8649171
    Abstract: In accordance with at least some embodiments, a computer system includes an enclosure (202) configured to hold at least one resource unit (204). The computer system also comprises a plurality of mixed-flow ducted fans units (400) selectively attached to the enclosure (202). Each mixed-flow ducted fan unit (400) comprises a duct (102) having an intake diameter, a bellmouth diameter, and an exhaust diameter. The bellmouth diameter is less than the intake diameter and the exhaust diameter.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: February 11, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John P Franz, Wade D. Vinson, Yousef Jarrah
  • Publication number: 20130174597
    Abstract: Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.
    Type: Application
    Filed: January 11, 2012
    Publication date: July 11, 2013
    Inventors: Tahir Cader, Ernesto Ferrer, Matthew R. Slaby, Wade D. Vinson
  • Publication number: 20120307440
    Abstract: In accordance with at least some embodiments, a computer system includes an enclosure (202) configured to hold at least one resource unit (204). The computer system also comprises a plurality of mixed-flow ducted fans units (400) selectively attached to the enclosure (202). Each mixed-flow ducted fan unit (400) comprises a duct (102) having an intake diameter, a bellmouth diameter, and an exhaust diameter. The bellmouth diameter is less than the intake diameter and the exhaust diameter.
    Type: Application
    Filed: February 26, 2010
    Publication date: December 6, 2012
    Inventors: John P. Franz, Wade D. Vinson, Yousef Jarrah