Abstract: An engageable assembly comprising a socket and a heat sink. The socket comprises a surface having an array of mounting holes that receive connector pins of an electronic device in order to mount the electronic device within the perimeter of the socket. The heat sink has a footprint extending beyond the perimeter of the socket and is in thermal contact with the electronic device when it is engaged with the socket. The socket and the heat sink include cooperative alignment tabs and alignment slots located outside the array of mounting holes. A locking lever is pivotally connected to an arm extending from the socket to a position outside of the footprint of the heat sink.

Abstract: An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A heat sink is in thermal contact with the electronic device and has a footprint extending beyond both the electronic device and the socket. A locking lever pivotally connects to an arm extending from the socket to a position outside of the footprint of the heat sink.

Abstract: An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A heat sink is in thermal contact with the electronic device and has a footprint extending beyond both the electronic device and the socket. A locking lever pivotally connects to an arm extending from the socket to a position outside of the footprint of the heat sink.

Abstract: A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.

Abstract: A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.