Abstract: An apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: An apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a rotatable latch coupled to the field-replaceable unit, via a pivot, at a first side of the field-replaceable unit, and a compliant spring member disposed to act on the pivot. The compliant spring member acts on the pivot and compresses with rotating of the latch from an open position to a latched position during latching of the field-replaceable unit within the enclosure. The compressing facilitates provision of a positive pressure on or across the field-replaceable unit directed towards a second side of the field-replaceable unit opposite to the first side. This positive pressure facilitates, for example, fixed coupling of a first connector at the second side of the field-replaceable unit to a second connector associated with the enclosure when the field-replaceable unit is latched within the enclosure.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a rotatable latch coupled to the field-replaceable unit, via a pivot, at a first side of the field-replaceable unit, and a compliant spring member disposed to act on the pivot. The compliant spring member acts on the pivot and compresses with rotating of the latch from an open position to a latched position during latching of the field-replaceable unit within the enclosure. The compressing facilitates provision of a positive pressure on or across the field-replaceable unit directed towards a second side of the field-replaceable unit opposite to the first side. This positive pressure facilitates, for example, fixed coupling of a first connector at the second side of the field-replaceable unit to a second connector associated with the enclosure when the field-replaceable unit is latched within the enclosure.

Abstract: A multi-chip electronic module includes a circuit board having a first end portion, a second end portion, a first surface portion and an opposing second surface portion. A plurality of electronic components is mounted to the first surface portion of the circuit board. A heat spreader member is supported at the first surface portion of the circuit board. The heat spreader includes a body having a first end, a second end, a first surface and a second surface. The first end portion and first end define a fluid inlet, and the second end portion and second end define a fluid outlet. The second surface is in thermal contact with the plurality of electronic components. The heat spreader member and circuit board define an enclosed fluid duct having a plurality of substantially parallel flow paths.

Abstract: A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.

Abstract: A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed portion and a removable portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the first and second thermal duct portions such that the block can be secured at least partially to either/or thermal duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.

Abstract: An exemplary embodiment is a fixture for securing hard stops to a substrate. The fixture has a base which provides support to the fixture. The base has a cavity configured for nestably supporting a substrate. A top plate is mounted on the base, the top plate is configured for mounting the substrate. An alignment plate is disposed on the top plate separate from the base. An adjusting plunger assembly is coupled to the base. The adjusting plunger assembly is configured for use with attaching a hard stop to the substrate. A plunger is coupled to the base substantially perpendicular to the adjusting plunger assembly. The plunger is configured for use with supporting the substrate. A method of using a fixture is disclosed comprising disposing a substrate in a base of the fixture and mounting a hard stop to the substrate. An adhesive is disposed between the hard stop and the substrate. The substrate is mounted between a plunger and a top plate. The hard stop on the substrate is aligned with an alignment plate.

Abstract: An exemplary embodiment is a method and apparatus for planarization. The planarization tool has a base which provides the support for the planarization tool. The base has a support hinge mounted on it along with dampening posts and rest posts which support a pivot plate hinged to the support hinge. A pressure assembly is mounted to the pivot plate by retention hardware. The pressure assembly loads a device under test board assembly that is mounted to the pressure assembly with the retention hardware.

Abstract: An exemplary embodiment is a fixture for securing hard stops to a substrate. The fixture has a base which provides support to the fixture. The base has a cavity configured for nestably supporting a substrate. A top plate is mounted on the base, the top plate is configured for mounting the substrate. An alignment plate is disposed on the top plate separate from the base. An adjusting plunger assembly is coupled to the base. The adjusting plunger assembly is configured for use with attaching a hard stop to the substrate. A plunger is coupled to the base substantially perpendicular to the adjusting plunger assembly. The plunger is configured for use with supporting the substrate. A method of using a fixture is disclosed comprising disposing a substrate in a base of the fixture and mounting a hard stop to the substrate. An adhesive is disposed between the hard stop and the substrate. The substrate is mounted between a plunger and a top plate. The hard stop on the substrate is aligned with an alignment plate.

Abstract: An exemplary embodiment is a method and apparatus for a multiple card enclosure. The multiple card enclosure is arranged for mounting a mother card enclosure and a daughter card enclosure and at least another daughter card enclosure. The mother card enclosure has a first and second daughter card enclosure removably inserted into the mother card enclosure for connecting the first and second daughter card with the mother card. The first daughter card enclosure and the second daughter card enclosure are independently removable to facilitate interchanging the first daughter card and the second daughter card. The daughter card enclosures connected to the mother card enclosure are enclosed in the multiple card enclosure and a mother card connects to a back plane connector of a logic board.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burn-in to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.

Abstract: A fixture to hold an electronic substrate having probe areas on a top surface. The top surface of the electronic substrate is left open to provide a maximum area to couple interconnect wires for a device under test. In addition, a bottom surface of the substrate is left open to provide a maximum area to couple with a probe card in one embodiment, or a test head in another embodiment. This open bottom and open top minimize the mechanical interference with electrical connections. The substrate is planarized to a frame by one or more clamps that are attached to the frame. The clamps provide adjustment of the pressure down on the substrate in a Z-axis direction which is normal to the top surface of the substrate for providing a good connection with a planar card. In addition, the clamps provide adjustment in the an X-Y plane parallel to the frame and rotational correction about the Z-axis.