Abstract: A material deposition device places droplets on a substrate. A conveyer on a chassis moves the substrate relative to a plane so a deposition means on the chassis may release material onto the substrate moved by the conveyer. A movable support means attached between the chassis and the deposition means locates it with respect to the conveyer allowing relative motion therebetween. A supply of material connected to the deposition means sends pressurized material thereto. A control causes relative motion between the conveyer and the movable support means varying the position of the deposition means relative to the substrate. The control has a memory operatively connected to timely activate the deposition means. The deposition means has a body communicating with the supply of material and a valve means responsive to the control selectively delivers droplets to the substrate.