Abstract: The present invention provides an improved Micro Cellular Urethane (hereinafter ‘MCU’) bump stop/spring aid having a plurality of struts adapted to level the rate transition as sections are folded onto one another. MCU bump stops/spring aids are well known in the art to assist vehicle suspension systems. More particularly, bump stops/spring aids are frequently used with vehicle suspension systems in connection with shocks and strut assemblies. These assemblies provide a comfortable ride in addition to influencing the control and handling of the vehicle. The struts are positioned around the circumference of the MCU bump stop/spring aid. The added struts between the undercuts partially support the outer surfaces of the MCU bump stop/spring aid. Struts are generally molded between the outer surfaces. Struts may also be molded on an inner surface. The plurality of struts improves upon existing technology by improving performance characteristics.

Abstract: The present invention provides a method of bonding suspension components which creates strong and durable bonding layer by using a chemical coating compatible with MCU. The bonding material uses coating materials to form an intermediated property bonding layer. This bonding layer prevents corrosion on the metal suspension components. The coating has the correct chemical activity to chemically bond MCU at the molecular level during the standard curing reaction. The coating provides an intermediated property layer to improve cyclic fatigue bonding performance, and bond effectively during molding and manufacturing operations.

Abstract: The present invention provides an improved Micro Cellular Urethane (hereinafter ‘MCU’) bump stop/spring aid having a plurality of struts adapted to level the rate transition as sections are folded onto one another. MCU bump stops/spring aids are well known in the art to assist vehicle suspension systems. More particularly, bump stops/spring aids are frequently used with vehicle suspension systems in connection with shocks and strut assemblies. These assemblies provide a comfortable ride in addition to influencing the control and handling of the vehicle. The struts are positioned around the circumference of the MCU bump stop/spring aid. The added struts between the undercuts partially support the outer surfaces of the MCU bump stop/spring aid. Struts are generally molded between the outer surfaces. Struts may also be molded on an inner surface. The plurality of struts improves upon existing technology by improving performance characteristics.

Abstract: The present invention provides a method of bonding suspension components which creates strong and durable bonding layer by using a chemical coating compatible with MCU. The bonding material uses coating materials to form an intermediated property bonding layer. This bonding layer prevents corrosion on the metal suspension components. The coating has the correct chemical activity to chemically bond MCU at the molecular level during the standard curing reaction. The coating provides an intermediated property layer to improve cyclic fatigue bonding performance, and bond effectively during molding and manufacturing operations.