Patents by Inventor Wade Jameson

Wade Jameson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component assembly with thermally conductive structures for image sensors
    Patent number: 12316935
    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
    Type: Grant
    Filed: April 8, 2024
    Date of Patent: May 27, 2025
    Assignee: Bio-Rad Laboratories, Inc.
    Inventors: Stephen Swihart, Li Lu, Wade Jameson, Evan Thrush, Michael Griffin, Evelio Perez
  • ELECTRONIC COMPONENT ASSEMBLY WITH THERMALLY CONDUCTIVE STRUCTURES FOR IMAGE SENSORS
    Publication number: 20240334032
    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
    Type: Application
    Filed: April 8, 2024
    Publication date: October 3, 2024
    Inventors: Stephen Swihart, Li Lu, Wade Jameson, Evan Thrush, Michael Griffin, Evelio Perez
  • Electronic component assembly with thermally conductive structures for image sensors
    Patent number: 11956522
    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: April 9, 2024
    Assignee: BIO-RAD LABORATORIES, INC.
    Inventors: Stephen Swihart, Li Lu, Wade Jameson, Evan Thrush, Michael Griffin, Evelio Perez
  • ELECTRONIC COMPONENT ASSEMBLY WITH THERMALLY CONDUCTIVE STRUCTURES FOR IMAGE SENSORS
    Publication number: 20230109519
    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 6, 2023
    Inventors: Stephen Swihart, Li Lu, Wade Jameson, Evan Thrush, Michael Griffin, Evelio Perez
  • Electronic component assembly with thermally conductive structures for image sensors
    Patent number: 11553116
    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: January 10, 2023
    Assignee: BIO-RAD LABORATORIES, INC.
    Inventors: Stephen Swihart, Li Lu, Wade Jameson, Evan Thrush, Michael Griffin, Evelio Perez
  • ELECTRONIC COMPONENT ASSEMBLY WITH THERMALLY CONDUCTIVE STRUCTURES FOR IMAGE SENSORS
    Publication number: 20210176386
    Abstract: An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 10, 2021
    Inventors: Stephen Swihart, Li Lu, Wade Jameson, Evan Thrush, Michael Griffin, Evelio Perez